5AGZME3H2F35I3LN

The 5AGZME3H2F35I3LN is an Arria V GZ field-programmable gate array (FPGA) IC designed for high-density programmable logic implementations. It combines up to 360,000 logic elements, approximately 23.95 Mbits of embedded memory, and up to 414 general-purpose I/Os to support complex, I/O-rich designs.

Built for industrial-grade operation, the device supports a core voltage range of 0.82–0.88 V and operates across a wide temperature range of −40 °C to 100 °C, making it suitable for demanding environments that require robust, high-capacity programmable logic.

Key Features

• Logic Capacity — 360,000 logic elements provide a large programmable fabric for complex custom logic and algorithm acceleration.
• Embedded Memory — Approximately 23.95 Mbits of on-chip RAM for buffering, look-up tables, and state storage within user designs.
• I/O Density — Up to 414 I/O pins to support extensive peripheral, sensor, and interface connectivity in a single device.
• Industrial Grade — Specified as an industrial-grade device with an operating temperature range of −40 °C to 100 °C for reliable operation in outdoor and factory environments.
• Power and Core Voltage — Core supply range specified at 820 mV to 880 mV (0.82–0.88 V) to align with modern FPGA core-voltage domains.
• Package & Mounting — 1152-ball BGA (FCBGA) package, supplier device package 1152-FBGA (35×35), designed for surface-mount assembly.
• Standards Compliance — RoHS-compliant for environmental regulatory alignment.

Typical Applications

• High-density digital logic — Implement complex, custom logic functions and data-path processing using the device’s 360,000 logic elements and large embedded memory.
• I/O-intensive systems — Systems that require extensive external interfacing can take advantage of up to 414 I/O pins.
• Industrial control and automation — Industrial-grade temperature range (−40 °C to 100 °C) and rugged specifications suit factory and field-deployed control systems.

Unique Advantages

• High programmable density: 360,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board count and system complexity.
• Significant on-chip memory: Approximately 23.95 Mbits of embedded RAM supports large buffering and state storage without external memory overhead.
• Extensive I/O capability: 414 I/Os simplify system integration where many external interfaces or parallel buses are required.
• Industrial temperature resilience: Rated operation from −40 °C to 100 °C for deployment in harsh or variable-temperature environments.
• Surface-mount BGA packaging: 1152-ball FCBGA (35×35) package enables compact board designs while supporting high pin-count routing.
• Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5AGZME3H2F35I3LN?

The 5AGZME3H2F35I3LN Arria V GZ FPGA delivers a combination of high logic capacity, substantial embedded memory, and broad I/O density within an industrial-grade footprint. Its electrical and thermal specifications make it appropriate for demanding embedded and control applications that require reliable, high-capacity programmable logic.

Designers seeking a scalable, high-density FPGA solution will find this device suitable for consolidating multiple functions, supporting complex data paths, and interfacing with many external systems, while meeting industrial operating requirements and RoHS compliance.

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