5AGZME3E3H29I4N

The 5AGZME3E3H29I4N is an Intel Arria V GZ field‑programmable gate array (FPGA) delivered in a 780‑BBGA (FCBGA) package. It provides high logic density and extensive on‑chip RAM with a large I/O count, packaged and specified for industrial‑grade applications.

Key attributes include approximately 360,000 logic elements, roughly 24 Mbits of embedded RAM, 342 I/O pins, a low‑voltage core supply range of 0.82–0.88 V, and an operating temperature range from −40 °C to 100 °C—features that align to demanding industrial and high‑density digital designs.

Key Features

• Core Logic — Approximately 360,000 logic elements for implementing large, complex digital functions and custom accelerators.
• Embedded Memory — Approximately 24 Mbits of on‑chip RAM to support large buffering, state storage, and tightly coupled memory requirements.
• I/O Capacity — 342 user I/O pins to interface with a broad range of peripherals, buses, and external devices.
• Power and Voltage — Core supply specified at 820 mV to 880 mV to meet low‑voltage design requirements.
• Package — 780‑ball BGA (FCBGA) package; supplier package noted as 780‑HBGA (33×33) for compact, high‑density board designs.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation for deployment in temperature‑stressed environments.
• Mounting and Compliance — Surface‑mount device with RoHS compliance for regulatory alignment and manufacturability.

Typical Applications

• Industrial Control and Automation — Industrial temperature rating and high logic density enable implementation of complex control logic and real‑time processing in factory and process environments.
• Custom Digital Processing — Large logic and embedded RAM resources support custom datapath implementations, hardware acceleration, and protocol offload.
• High‑I/O Systems — High pin count (342 I/Os) for systems requiring multiple parallel interfaces, sensors, or bus connections.

Unique Advantages

• High Logic Density: Approximately 360,000 logic elements allow consolidation of large designs into a single device, reducing board complexity.
• Substantial On‑Chip Memory: Around 24 Mbits of embedded RAM supports buffering and stateful processing without immediate need for external memory.
• Extensive I/O: 342 I/O pins provide flexibility for interfacing multiple peripherals and parallel buses directly from the FPGA.
• Industrial Reliability: Specified operating range from −40 °C to 100 °C enables deployment in temperature‑challenging environments.
• Low‑Voltage Core: Core supply range of 0.82–0.88 V aligns with low‑voltage system architectures and power management strategies.
• RoHS Compliant, Surface‑Mount Packaging: 780‑BBGA FCBGA package supports compact, manufacturable designs while meeting environmental directives.

Why Choose 5AGZME3E3H29I4N?

The 5AGZME3E3H29I4N Arria V GZ FPGA combines high logic capacity, significant embedded RAM, and a large I/O complement in an industrial‑rated FCBGA package. It is suited to engineers and teams aiming to implement large, integrated digital systems where consolidation, I/O flexibility, and reliable operation across a wide temperature range are priorities.

With documented device electrical and configuration specifications available from the manufacturer, this FPGA is positioned for designs that require scalable logic resources and robust thermal performance in industrial deployments.

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