5AGZME3E3H29C4N

The 5AGZME3E3H29C4N is an Arria V GZ family FPGA in a 780-ball BGA package designed for commercial-grade, surface-mount board designs. It provides a high-capacity programmable fabric with a substantial embedded memory complement and a large I/O count to support complex, I/O‑dense designs.

This device targets applications that require up to 360,000 logic elements, approximately 24 Mbits of embedded RAM, and 342 user I/Os while operating within a core supply range of 820 mV to 880 mV and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Capacity  360,000 logic elements (logic element cells) provide a large programmable fabric for complex logic and custom hardware implementations.
• Embedded Memory  Approximately 24 Mbits of on-chip RAM (23,946,240 bits) for buffering, lookup tables, and local data storage.
• I/O Density  342 user I/O pins to support wide parallel interfaces and dense board-level connectivity.
• Package  780-BBGA, FCBGA package case with supplier device package listing as 780-HBGA (33×33) for compact, high-density mounting.
• Power  Core supply specified from 820 mV to 880 mV to support the device’s operating point requirements.
• Thermal and Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Mounting & Compliance  Surface-mount package and RoHS compliant for standard production and assembly processes.

Typical Applications

• High-density FPGA designs  Systems that require hundreds of thousands of logic elements and substantial embedded memory.
• I/O‑intensive systems  Board-level designs that need a large number of user I/Os for parallel interfaces or multiple peripheral connections.
• Compact, surface-mount solutions  Applications requiring a BGA footprint (33×33 supplier package) for space-efficient PCB layouts.
• Commercial electronic products  Deployments within the commercial temperature range (0 °C to 85 °C) where RoHS compliance is required.

Unique Advantages

• High programmable capacity: The 360,000 logic elements allow implementation of complex functions and substantial custom hardware acceleration on a single device.
• Substantial on-chip RAM: Approximately 24 Mbits of embedded RAM reduces reliance on external memory for intermediate storage and buffering.
• Extensive I/O resources: 342 I/Os simplify interfacing to multiple peripherals and high-bandwidth parallel buses without external multiplexing.
• BGA packaging for compact designs: The 780-ball BGA (33×33) enables high-density board integration while maintaining robust connectivity.
• Commercial readiness: Surface-mount, RoHS-compliant construction and a defined operating temperature range support standard commercial product deployment.
• Deterministic power window: Defined core supply range (820 mV–880 mV) provides clear power design requirements for system integrators.

Why Choose 5AGZME3E3H29C4N?

The 5AGZME3E3H29C4N Arria V GZ FPGA combines a large logic fabric, nearly 24 Mbits of embedded memory, and a high I/O count within a compact 780-ball BGA package, making it suited to commercial designs that demand high integration and board-level density. Its defined voltage and temperature ranges simplify system power and thermal planning.

This part is appropriate for engineers and procurement teams building I/O-heavy, logic-dense solutions who require a RoHS-compliant, surface-mount FPGA with clear, verifiable specifications for logic capacity, memory, I/O, package, and operating conditions.

Request a quote or submit an inquiry for pricing and availability of 5AGZME3E3H29C4N to begin integrating this Arria V GZ device into your next design.