5AGZME3E2H29C3N

The 5AGZME3E2H29C3N is an Arria V GZ Field Programmable Gate Array (FPGA) IC in a 780-BBGA (FCBGA) package. It delivers a high-density programmable fabric with 360,000 logic elements and approximately 24 Mbits of embedded memory for complex logic, buffering, and on-chip data storage.

Designed for commercial-grade applications, this surface-mount device provides 342 user I/O signals, a tight core voltage supply range, and an operating temperature range suitable for standard commercial environments.

Key Features

• High-density core — 360,000 logic elements to implement large-scale custom logic and parallel processing pipelines.
• On-chip memory — Approximately 24 Mbits of embedded RAM (23,946,240 total bits) for local buffering, FIFOs, and state storage.
• I/O capacity — 342 user I/O pins to support extensive peripheral, bus, and interface connectivity.
• Power and supply — Core voltage supply range specified from 820 mV to 880 mV for defined power-domain design and supply sequencing.
• Package and mounting — 780-BBGA (FCBGA) package with supplier device package 780-HBGA (33×33) in a surface-mount form factor for compact board integration.
• Commercial grade and temperature — Rated for commercial use with an operating temperature range of 0 °C to 85 °C.
• RoHS compliant — Meets RoHS environmental requirements.

Typical Applications

• High-density logic implementations — Use the large logic-element count for complex state machines, datapath acceleration, and custom protocol engines.
• On-chip buffering and packet processing — Leverage approximately 24 Mbits of embedded RAM for buffering, packet queues, and temporary data storage.
• Multi-I/O system integration — 342 I/O signals enable integration with diverse peripherals, memory interfaces, and I/O standards in compact designs.

Unique Advantages

• Scalable logic capacity: 360,000 logic elements support substantial design complexity without external HDL expansions.
• Significant embedded memory: Approximately 24 Mbits of on-chip RAM reduces dependency on external memory for many buffering and storage needs.
• Extensive connectivity: 342 I/O pins provide the flexibility to connect multiple subsystems and parallel interfaces directly to the FPGA.
• Compact, surface-mount package: 780-BBGA (33×33) package supports high-density PCB layouts while delivering the device’s full I/O and core capabilities.
• Commercial-grade qualification: Rated for 0 °C to 85 °C operation, suitable for standard commercial electronic systems.
• Controlled core voltage: Narrow supply range (820 mV–880 mV) aids predictable power-domain design and thermal planning.

Why Choose 5AGZME3E2H29C3N?

The 5AGZME3E2H29C3N Arria V GZ FPGA offers a combination of high logic density, substantial embedded memory, and broad I/O capability in a compact 780-BBGA package. Its commercial-grade rating and defined electrical specifications make it well suited to designers implementing complex digital systems that require significant on-chip resources and flexible interfacing.

Choose this device for projects that demand dense programmable logic, on-chip RAM to minimize external memory needs, and a high pin-count footprint for system integration—delivering a balance of performance, integration, and predictable operating conditions supported by Arria V device specifications.

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