5AGZME3E2H29I3LG

IC FPGA 342 I/O 780HBGA
Part Description

Arria V GZ Field Programmable Gate Array (FPGA) IC 342 23946240 360000 780-BBGA, FCBGA

Quantity 1,352 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O342Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs16980Number of Logic Elements/Cells360000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits23946240

Overview of 5AGZME3E2H29I3LG – Arria V GZ Field Programmable Gate Array (FPGA), 360,000 logic elements, 780-BBGA FCBGA

The 5AGZME3E2H29I3LG is an Arria V GZ Field Programmable Gate Array (FPGA) IC in a 780-BBGA FCBGA package. It delivers large on-chip programmable logic and embedded memory in a surface-mount, industrial-grade device designed for complex digital designs.

Key attributes include approximately 360,000 logic elements, approximately 24 Mbits of embedded RAM, 342 I/Os, a tightly specified core supply range, and an extended operating temperature span suitable for industrial environments.

Key Features

  • Core Logic  Approximately 360,000 logic elements to implement large-scale programmable logic and complex custom datapaths.
  • Embedded Memory  Approximately 24 Mbits of on-chip RAM (23,946,240 total RAM bits) for buffering, lookup tables, and state storage without external memory.
  • I/O Density  342 I/O pins to support wide parallel interfaces and multiple peripheral connections on a single device.
  • Power Supply  Specified core voltage supply range of 820 mV to 880 mV for consistent core operation within datasheet limits.
  • Package & Mounting  780-BBGA (FCBGA) supplier device package 780-HBGA (33×33), surface-mount mounting for high-density board integration.
  • Industrial Operating Range  Grade: Industrial; operating temperature from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Standards Compliance  RoHS compliant, meeting common lead-free regulatory requirements for electronic assemblies.
  • Documentation  Supported by the Arria V device datasheet, which includes electrical characteristics, configuration specifications, I/O timing, and power/operating-condition details specific to Arria V GZ devices.

Unique Advantages

  • High logic capacity: Large logic element count enables consolidation of multiple functions into a single FPGA, reducing board-level complexity.
  • Substantial on-chip memory: Approximately 24 Mbits of embedded RAM reduce dependence on external memory and speed system-level data handling.
  • Extensive I/O: 342 I/Os provide flexibility for parallel interfaces, multiple buses, and diverse peripheral connections from one device.
  • Industrial temperature qualification: −40 °C to 100 °C operating range supports deployment in demanding thermal environments.
  • Surface-mount, high-density package: 780-BBGA FCBGA (33×33) package allows compact PCB designs while exposing a high pin count for system integration.

Why Choose 5AGZME3E2H29I3LG?

The 5AGZME3E2H29I3LG Arria V GZ FPGA combines a high logic element count, significant embedded memory, and a large I/O complement in an industrial-grade, surface-mount 780-BBGA package. Its defined core voltage range and extended operating temperature make it suitable for robust, long-life electronics requiring dense programmable logic and on-chip RAM.

Engineers seeking a scalable programmable-logic building block can rely on the Arria V family datasheet for detailed electrical, configuration, and timing specifications when integrating this device into their designs.

Request a quote or submit an inquiry to purchase this Arria V GZ FPGA and confirm availability and lead times for your project requirements.

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