5AGZME1H3F35I4G

The 5AGZME1H3F35I4G is an Arria V GZ family FPGA in a 1152‑BBGA (FCBGA) package designed for industrial‑grade embedded logic applications. It provides a large programmable fabric with extensive on‑chip memory and a high I/O count, combined with a low core voltage operating window and a wide industrial temperature range.

Engineers can leverage its 220,000 logic elements and approximately 15.3 Mbits of embedded memory to implement complex digital functions while using up to 414 I/O pins for dense peripheral and system interfacing. The device is RoHS compliant and supplied in a surface‑mount 1152‑FBGA (35×35) package.

Key Features

• Core & Logic — 220,000 logic elements and approximately 10,377 logic blocks provide extensive programmable logic capacity for complex designs.
• Embedded Memory — Approximately 15.3 Mbits of on‑chip RAM to support buffering, packet processing, and local data storage within the FPGA fabric.
• I/O Density — 414 available I/O pins for broad system interconnection and flexible peripheral interfacing.
• Power — Core voltage supply nominal range from 820 mV to 880 mV to match system power rails and core power budgeting.
• Package & Mounting — 1152‑BBGA FCBGA, supplier package 1152‑FBGA (35×35), surface‑mount mounting for compact board integration.
• Operating Range — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance — RoHS compliant for adherence to environmental regulations.

Typical Applications

• Industrial control systems — Use the device’s industrial temperature range and large logic capacity to implement deterministic control, PLC functions, and custom state machines.
• High‑density I/O bridging — 414 I/O pins enable dense peripheral aggregation, protocol bridging, and complex board‑level I/O mapping.
• Data buffering and packet handling — Approximately 15.3 Mbits of embedded memory supports on‑chip buffering and intermediate data storage for multi‑stream processing.
• Custom digital signal processing — Large logic element count allows implementation of sizable parallel pipelines and custom DSP blocks within the FPGA fabric.

Unique Advantages

• Scalable logic capacity: 220,000 logic elements and around 10,377 logic blocks accommodate large custom logic implementations without external CPLD/ASIC partitioning.
• Substantial on‑chip RAM: Approximately 15.3 Mbits of embedded memory reduces dependence on external memory for intermediate storage and buffering.
• High I/O availability: 414 I/O pins provide flexibility for multi‑interface systems and dense board designs.
• Industrial reliability: Rated for −40 °C to 100 °C operation, enabling deployment in temperature‑challenging environments.
• Compact, manufacturable package: 1152‑BBGA (35×35) surface‑mount package supports high‑density PCB layouts and automated assembly.
• Low core voltage window: 0.820–0.880 V supply range supports designs targeting reduced core power and specific power distribution architectures.

Why Choose 5AGZME1H3F35I4G?

The 5AGZME1H3F35I4G Arria V GZ FPGA combines a large programmable fabric with significant embedded memory and a high I/O count in a manufacturable FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for long‑lifecycle embedded systems that require on‑board programmability and dense logic integration.

This part is well suited to engineering teams building complex control, interfacing, or data‑handling subsystems that need substantial local logic and memory capacity while maintaining compact board footprint and manufacturability.

Request a quote or submit a pricing inquiry to obtain availability and lead‑time information for the 5AGZME1H3F35I4G Arria V GZ FPGA.