5AGZME1H3F35I4N

IC FPGA 414 I/O 1152FBGA
Part Description

Arria V GZ Field Programmable Gate Array (FPGA) IC 414 15282176 220000 1152-BBGA, FCBGA

Quantity 1,118 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O414Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs10377Number of Logic Elements/Cells220000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits15282176

Overview of 5AGZME1H3F35I4N – Arria V GZ Field Programmable Gate Array (FPGA) IC

The 5AGZME1H3F35I4N is an Intel Arria V GZ series field programmable gate array supplied in a 1152-BBGA (FCBGA) surface-mount package. This industrial-grade device provides 220,000 logic elements, approximately 15.28 Mbits of on-chip RAM, and 414 user I/O pins for complex, high‑density programmable designs. The device is specified for a core supply range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C, and it is RoHS compliant.

Key Features

  • Programmable logic 220,000 logic elements for implementing large-scale, customized digital logic functions.
  • Embedded memory Approximately 15.28 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic functions.
  • I/O capacity 414 I/O pins to interface with a wide range of peripherals, buses, and external devices.
  • Package & mounting 1152-BBGA (FCBGA) surface-mount package; supplier device package listed as 1152-FBGA (35×35).
  • Voltage supply Core supply specified from 820 mV to 880 mV to match system power rails and power-management designs.
  • Industrial operating range Rated for −40 °C to 100 °C operation for deployments that require extended temperature capability.
  • Regulatory RoHS compliant.

Unique Advantages

  • High-density logic capacity: 220,000 logic elements provide the implementation headroom needed for complex digital architectures and large FPGA designs.
  • Substantial on-chip RAM: Approximately 15.28 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
  • Flexible I/O count: 414 I/O pins enable broad peripheral connectivity and flexible board-level partitioning.
  • Industrial robustness: Specified for −40 °C to 100 °C operation to support systems operating across wide temperature ranges.
  • Compact, surface-mount package: 1152-BBGA FCBGA package and 35×35 supplier footprint simplify board layout for high-density applications.
  • Compliance-ready: RoHS compliance helps meet environmental and regulatory requirements.

Why Choose 5AGZME1H3F35I4N?

The 5AGZME1H3F35I4N positions itself as a high-capacity Arria V GZ FPGA option for designs that require significant programmable logic resources, substantial embedded memory, and a large I/O complement within a compact BGA footprint. Its industrial temperature rating and RoHS compliance make it suitable for long-life and environmentally constrained deployments.

This device is suitable for engineering teams and procurement seeking a programmable-logic IC with verified electrical and packaging specifications—providing design scalability, on-chip memory resources, and a clear operating-voltage and temperature envelope.

Request a quote or submit an inquiry to our sales team for pricing, availability, and lead-time information on part 5AGZME1H3F35I4N.

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