5AGZME1H3F35C4G

The 5AGZME1H3F35C4G is an Arria V GZ FPGA in a 1152‑FBGA (35×35) package designed for commercial‑grade programmable logic applications. It combines 220,000 logic elements with substantial embedded RAM and a high I/O count to support designs that require dense logic, on‑chip memory, and broad peripheral connectivity.

This device operates from a core voltage supply range of 820 mV to 880 mV, is intended for surface‑mount assembly, and is rated for commercial operating temperatures from 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic Capacity — 220,000 logic elements to implement complex programmable logic and custom hardware functions.
• Embedded Memory — Total on‑chip RAM of 15,282,176 bits (approximately 15.28 Mbits) for buffering, FIFOs, and data processing.
• I/O Resources — 414 I/O pins to support dense peripheral interfacing and multi‑channel connectivity.
• Package & Mounting — 1152‑BBGA / 1152‑FBGA (35×35) package in an FCBGA form factor, designed for surface‑mount PCB assembly.
• Power — Core voltage supply specified between 820 mV and 880 mV to match system power budgeting and regulator design.
• Operating Conditions & Grade — Commercial temperature grade with specified operating range of 0 °C to 85 °C.
• Regulatory — RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• Programmable system logic — Implement custom control, glue logic, and protocol handling using the device’s 220,000 logic elements and embedded RAM.
• I/O‑rich interface hubs — Aggregate and translate multiple peripheral interfaces leveraging 414 I/O pins for connectivity.
• On‑chip buffering and streaming — Use approximately 15.28 Mbits of embedded memory for data buffering, FIFO implementation, and real‑time data handling.

Unique Advantages

• Large programmable capacity: 220,000 logic elements provide room to implement complex logic, state machines, and custom datapaths within a single device.
• Significant embedded RAM: Approximately 15.28 Mbits of on‑chip memory reduces external memory requirements for many buffering and processing tasks.
• High I/O density: 414 I/O pins enable broad peripheral support and flexible board‑level partitioning.
• Compact FCBGA footprint: 1152‑FBGA (35×35) package offers a dense package option for space‑constrained PCBs while supporting surface‑mount assembly.
• Controlled power envelope: Core supply specified between 820 mV and 880 mV enables precise power planner designs and regulator selection.
• Commercial deployment: Rated for 0 °C to 85 °C operation for commercial‑grade end products and development platforms.

Why Choose 5AGZME1H3F35C4G?

The 5AGZME1H3F35C4G Arria V GZ FPGA is targeted at designs that need substantial programmable logic, significant on‑chip memory, and a high number of I/Os in a compact FCBGA package. Its combination of 220,000 logic elements, approximately 15.28 Mbits of embedded RAM, and 414 I/O pins makes it well suited for commercial systems requiring integrated logic and buffering without immediately resorting to multiple discrete devices.

Choosing this device supports design consolidation and reduces external component count for applications that fit within the specified commercial temperature and core voltage ranges. It is RoHS compliant and supplied in a surface‑mount 1152‑FBGA package for modern PCB assembly flows.

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