5AGZME1H2F35C3N

The Intel Arria V GZ FPGA 5AGZME1H2F35C3N is a commercial-grade, surface-mount programmable logic device designed for high-density digital designs. It provides 220,000 logic elements, up to 414 general-purpose I/O pins, and approximately 15.3 Mbits of embedded RAM, packaged in a 1152-BBGA (1152-FBGA, 35×35) footprint.

Referencing the Arria V GZ device datasheet, this device’s published documentation covers electrical and switching characteristics, configuration specifications, and detailed I/O timing to support integration into board- and system-level designs.

Key Features

• Logic Capacity — 220,000 logic elements to implement complex custom logic, state machines, and datapaths.
• Embedded Memory — Approximately 15.3 Mbits of on-chip RAM for buffering, lookup tables, and local storage.
• I/O Density — 414 I/O pins to support broad peripheral connectivity and parallel interfaces.
• Package & Mounting — 1152-BBGA (supplier package: 1152-FBGA, 35×35) with surface-mount mounting type for compact board integration.
• Power Supply Range — Core voltage specified from 820 mV to 880 mV to match system regulator design requirements.
• Operating Temperature — Commercial temperature range of 0 °C to 85 °C, suitable for standard commercial applications.
• Standards Compliance — RoHS compliant; conforms to environmental and material compliance expectations for commercial electronic components.
• Documented Electrical & Timing Data — Datasheet includes electrical characteristics, switching and transceiver performance sections, configuration specifications, and I/O timing guidance to support design and validation.

Typical Applications

• Custom digital systems — Implement bespoke logic and control functions that require up to 220,000 logic elements and extensive I/O.
• High-density interfacing — Use the 414 I/O pins and on-chip memory to consolidate multiple peripheral interfaces and local buffering on a single device.
• FPGA-based prototyping — Evaluate complex logic architectures and system-level designs within a commercial temperature-rated platform.

Unique Advantages

• High integration density: 220,000 logic elements and ~15.3 Mbits of embedded RAM reduce the need for external logic and memory, simplifying system BOM and board routing.
• Extensive I/O count: 414 I/O pins enable direct connections to a wide range of peripherals and parallel interfaces, lowering the need for extra I/O expanders.
• Compact packaging: 1152-BBGA (35×35) package provides a small board footprint for high-pin-count implementations.
• Well-documented specifications: Device-level datasheet coverage of electrical, switching, configuration, and I/O timing data helps accelerate integration and validation.
• Commercial-grade availability: Designed and specified for commercial temperature environments (0 °C to 85 °C) and RoHS compliance for mainstream electronics production.

Why Choose 5AGZME1H2F35C3N?

The 5AGZME1H2F35C3N Arria V GZ FPGA delivers a balanced combination of logic density, embedded memory, and high I/O count in a compact BGA package—making it suitable for designers who need significant on-chip resources without expanding board footprint. Its documented electrical and timing characteristics in the Arria V GZ datasheet provide the information required for reliable system-level integration and timing closure.

This device is well suited to commercial designs that demand flexible, reprogrammable logic and moderate environmental ranges, with the support of comprehensive device documentation to streamline development and qualification.

Request a quote or submit a request for availability and pricing to receive detailed commercial terms and lead-time information for the 5AGZME1H2F35C3N Arria V GZ FPGA.