5AGZME1H2F35I3LG

The 5AGZME1H2F35I3LG is an Arria V GZ series Field Programmable Gate Array (FPGA) in an industrial grade package. It delivers large programmable logic capacity and on-chip embedded memory for complex system designs requiring significant logic resources and dense I/O.

Targeted at industrial and high-performance embedded applications, this surface-mount FCBGA device combines 220,000 logic elements, approximately 15.3 Mbits of embedded memory, and 414 I/Os in a 1152-BBGA (35×35 mm) package, with an operating range suited for industrial environments.

Key Features

• Logic Capacity — 220,000 logic elements to implement large-scale custom logic, state machines, and datapaths.
• Embedded Memory — Approximately 15.3 Mbits of on-chip RAM for buffers, FIFOs, and on-device data storage.
• I/O Density — 414 user I/Os to support wide parallel interfaces, multi-channel connectivity, and high-pin-count designs.
• Package & Mounting — 1152-BBGA, FCBGA (supplier package 1152-FBGA, 35×35 mm); surface-mount mounting for board-level integration.
• Industrial Grade — Device is specified as industrial grade with the –I3 speed grade.
• Operating Range — Rated for operation from –40 °C to 100 °C to meet industrial temperature requirements.
• Core Voltage — Core supply range of 820 mV to 880 mV for power domain planning and thermal design.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Automation — Implement motion control logic, deterministic I/O, and protocol bridging using the device’s large logic and I/O resources.
• Communications Infrastructure — Use dense logic and embedded memory for packet processing, signal interfacing, and custom packet engines that require many I/Os.
• High‑Performance Embedded Systems — Deploy as the central programmable fabric for compute- and I/O‑intensive embedded platforms.
• Video & Imaging Processing — Leverage high logic capacity and on-chip RAM for video pipelines, buffering, and real‑time image processing tasks.

Unique Advantages

• High Implementable Logic: 220,000 logic elements enable complex algorithms and wide datapaths without external logic expansion.
• Substantial On‑Chip Memory: Approximately 15.3 Mbits of embedded RAM reduces dependency on external memory for mid‑latency buffering and data staging.
• Dense I/O Connectivity: 414 I/Os provide flexibility for interfacing many peripherals, parallel buses, and multi-lane systems on a single device.
• Industrial Temperature Support: –40 °C to 100 °C operation supports deployments in harsh or temperature‑sensitive environments.
• Compact BGA Packaging: 1152‑BBGA (35×35 mm) balances high pin count with PCB area efficiency for board-level integration.
• Regulatory Compliance: RoHS compliance simplifies environmental and manufacturing requirements.

Why Choose 5AGZME1H2F35I3LG?

The 5AGZME1H2F35I3LG Arria V GZ FPGA combines a high logic element count, multi-megabit embedded memory, and hundreds of I/Os in an industrial-grade, surface-mount BGA package. It is suited for designers who need scalable programmable logic and high I/O density in temperature-challenging environments.

Choosing this device supports designs that require significant on-chip resources while maintaining compact board integration and regulatory compliance. For detailed electrical characteristics, configuration timing, and device-level specifications, refer to the Arria V device documentation and datasheet materials provided by the manufacturer.

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