5AGZME1E3H29I4N

IC FPGA 342 I/O 780HBGA
Part Description

Arria V GZ Field Programmable Gate Array (FPGA) IC 342 15282176 220000 780-BBGA, FCBGA

Quantity 741 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O342Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs10377Number of Logic Elements/Cells220000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits15282176

Overview of 5AGZME1E3H29I4N – Arria V GZ FPGA, 220,000 logic elements, 15.3 Mbits RAM, 342 I/Os

The 5AGZME1E3H29I4N is an Arria V GZ Field Programmable Gate Array (FPGA) in a 780-BBGA (FCBGA) package, offered in an industrial grade. It delivers a high-density programmable fabric with substantial on-chip memory and a large I/O count for systems requiring flexible, field-upgradable logic and peripheral interfacing.

Designed for applications that demand a balance of logic capacity, embedded memory, and wide I/O integration, this device targets industrial designs operating across a broad temperature range while meeting RoHS environmental requirements.

Key Features

  • Logic Capacity  Approximately 220,000 logic elements provide the programmable fabric to implement complex logic, custom datapaths, and state machines.
  • Embedded Memory  Approximately 15.3 Mbits of on-chip RAM for buffering, frame storage, and intermediate data processing.
  • I/O Density  342 user I/Os enable extensive peripheral and board-level interfacing for multi-channel systems and high-pin-count designs.
  • Power and Core Supply  Core voltage range of 820 mV to 880 mV to support the device’s internal power requirements.
  • Package and Mounting  780-BBGA (FCBGA) package, supplier package listed as 780-HBGA (33×33), designed for surface-mount assembly.
  • Temperature Range  Industrial operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
  • Compliance  RoHS compliant, supporting environmental and regulatory requirements for lead-free assembly.

Typical Applications

  • Industrial Control and Automation  Programmable logic and high I/O count enable custom control algorithms, sensor aggregation, and machine interfacing in industrial systems.
  • Communications Infrastructure  Large logic and memory resources support protocol processing, framing, and multi-channel I/O tasks in network equipment.
  • Signal Processing and Compute Acceleration  On-chip RAM and abundant logic cells allow implementation of custom data paths and streaming processing pipelines.
  • Prototyping and System Integration  Field-programmable fabric with extensive I/O simplifies integration of bespoke interfaces during development and system validation.

Unique Advantages

  • High-density programmable fabric: 220,000 logic elements enable implementation of complex custom logic and large-scale designs without external ASICs.
  • Substantial embedded memory: Approximately 15.3 Mbits of on-chip RAM reduces dependency on external memory for buffering and intermediate storage.
  • Extensive I/O availability: 342 I/Os provide flexibility for multi-channel interfaces, sensor arrays, and peripheral-rich board designs.
  • Industrial-grade thermal range: Rated for −40 °C to 100 °C operation to support deployment in harsh or temperature-variable environments.
  • Compact BGA footprint: 780-BBGA (33×33 supplier package) offers a high-pin-count solution in a board-friendly surface-mount package.
  • Regulatory compliance: RoHS compliance supports modern, lead-free manufacturing flows and environmental requirements.

Why Choose 5AGZME1E3H29I4N?

The 5AGZME1E3H29I4N Arria V GZ FPGA combines a high logic element count, significant on-chip RAM, and a large complement of I/Os in an industrial-grade BGA package. It is suited to designers who need field-programmable flexibility alongside the capacity to implement complex datapaths and interface-rich systems within a robust thermal envelope.

With comprehensive device documentation available, the part supports engineering evaluation, system integration, and production deployment where scalability, integration, and predictable environmental performance are priorities.

Request a quote or submit an inquiry to receive pricing, availability, and additional procurement details for 5AGZME1E3H29I4N.

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