5AGZME1E3H29C4G

The 5AGZME1E3H29C4G is an Arria V GZ Field Programmable Gate Array (FPGA) from Intel presented in a 780-ball BGA (FCBGA) package. This commercial-grade device provides 220,000 logic elements, approximately 15.28 Mbits of embedded memory, and 342 user I/O pins, making it suitable for high-density, I/O-rich designs.

Electrical and configuration behavior for the Arria V family is documented in the device datasheet, which includes operating conditions, switching characteristics, configuration timing, and initialization details for the Arria V GZ devices.

Key Features

• Logic Capacity — 220,000 logic elements to implement complex digital functions and custom hardware blocks.
• Embedded Memory — Approximately 15.28 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Resources — 342 user I/O pins to support wide interfaces and parallel connections.
• Package and Mounting — 780-BBGA (FCBGA) package, supplier device package 780-HBGA (33×33); surface-mount mounting type for board-level assembly.
• Power Supply — Core supply specified at 820 mV to 880 mV, enabling defined core-power design and supply planning.
• Temperature Grade — Commercial grade with an operating temperature range of 0°C to 85°C.
• RoHS Compliance — Device is RoHS compliant.
• Comprehensive Datasheet Coverage — Datasheet includes detailed electrical characteristics, configuration specifications (JTAG, AS, PS, FPP, etc.), POR and initialization timing, and I/O timing information specific to Arria V GZ devices.

Typical Applications

• High-density logic designs — Use where up to 220,000 logic elements are required to implement custom processing, DSP, or glue logic.
• I/O-intensive systems — Suitable for boards and modules that require 342 user I/Os for parallel interfaces and extensive routing.
• Embedded memory-centric functions — For designs that leverage approximately 15.28 Mbits of on-chip RAM for buffering, packet storage, or local data processing.
• Commercial embedded systems — Targeted for commercial temperature-range applications (0°C to 85°C) with documented power and configuration requirements.
• Surface-mount PCB assemblies — Designed for surface-mount integration in compact FCBGA form factors (780-ball, 33×33 footprint).

Unique Advantages

• High integration density: 220,000 logic elements allow consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial on-chip RAM: Approximately 15.28 Mbits of embedded memory supports local buffering and state storage without external memory for many tasks.
• Extensive I/O: 342 user I/Os provide flexibility for interfacing to a wide array of peripherals and parallel buses.
• Defined power envelope: Core voltage range (820 mV to 880 mV) gives clear guidance for power-supply design and thermal planning.
• Commercial-grade certification: Operates across a commercial temperature range (0°C–85°C) appropriate for many embedded systems and industrial environments that require standard commercial components.
• Fully documented behavior: The Arria V GZ datasheet includes detailed electrical, timing, and configuration specifications to support deterministic design and system integration.

Why Choose 5AGZME1E3H29C4G?

The 5AGZME1E3H29C4G Arria V GZ FPGA combines large logic capacity, significant embedded memory, and a high I/O count in a compact 780-ball FCBGA package. Its documented operating conditions, configuration timing, and electrical characteristics make it a practical choice for designers who need predictable behavior and comprehensive specification coverage during system development.

This device is suited to teams and projects that require high-density logic, on-chip RAM, and extensive I/O within a commercial temperature envelope, supported by the Arria V device documentation for configuration and electrical integration.

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