5AGZME1E2H29I3LN
| Part Description |
Arria V GZ Field Programmable Gate Array (FPGA) IC 342 15282176 220000 780-BBGA, FCBGA |
|---|---|
| Quantity | 185 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 342 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 10377 | Number of Logic Elements/Cells | 220000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 15282176 |
Overview of 5AGZME1E2H29I3LN – Arria V GZ Field Programmable Gate Array (FPGA) IC
The 5AGZME1E2H29I3LN is an industrial-grade Arria V GZ FPGA in a 780-BBGA (FCBGA) package. The device integrates 220,000 logic elements and approximately 15.3 Mbits of on-chip RAM to address complex, high‑density programmable logic requirements. With 342 I/O pins, a compact 780‑HBGA (33×33) supplier package footprint, and a wide operating temperature range, it is intended for robust embedded and industrial electronic designs.
Key Features
- Logic Capacity 220,000 logic elements for implementing large-scale digital designs and custom accelerators.
- On‑Chip Memory Approximately 15.3 Mbits of total RAM bits to support buffering, storage, and memory‑intensive logic functions.
- I/O Density 342 user I/O pins to support multiple parallel interfaces and high‑channel designs.
- Power and Core Supply Operates from a core supply range of 820 mV to 880 mV, enabling tightly controlled power delivery for core logic.
- Package and Mounting 780-BBGA (FCBGA) package with supplier device package 780‑HBGA (33×33); surface-mount design suitable for compact board layouts.
- Industrial Temperature Grade Rated for operation from −40°C to 100°C to meet demanding environmental conditions.
- Regulatory RoHS compliant.
Typical Applications
- Industrial Control Systems Industrial-grade temperature range and high logic density enable custom control, automation, and monitoring applications in harsher environments.
- High‑Density I/O Interfaces 342 I/O pins support designs requiring numerous parallel or multiplexed connections for data acquisition and peripheral interfacing.
- Memory‑Intensive Logic Approximately 15.3 Mbits of embedded RAM for on‑chip buffering, packet memory, and intermediate data storage in processing pipelines.
- Custom Digital Acceleration Large logic element count supports implementation of specialized accelerators, DSP blocks, and complex state machines.
Unique Advantages
- High Logic Density: 220,000 logic elements provide headroom for large, integrated designs and reduce the need for multiple devices.
- Substantial Embedded Memory: Approximately 15.3 Mbits of on‑chip RAM lowers external memory dependence and simplifies board-level memory architecture.
- Robust I/O Capability: 342 I/O pins allow flexible interfacing and support high‑channel count systems without external expanders.
- Industrial Reliability: −40°C to 100°C operating range and industrial grade marking support deployment in temperature-challenging environments.
- Compact Surface‑Mount Package: 780‑BBGA / 780‑HBGA (33×33) packaging balances high pin count with a compact PCB footprint for space-constrained designs.
- Compliance: RoHS compliance supports regulatory and environmental requirements for commercial and industrial products.
Why Choose 5AGZME1E2H29I3LN?
The 5AGZME1E2H29I3LN Arria V GZ FPGA is positioned for designers who require a high logic count, significant on‑chip memory, and substantial I/O in an industrial-temperature, surface‑mount package. Its combination of 220,000 logic elements, approximately 15.3 Mbits of embedded RAM, and 342 I/O pins delivers an integrated solution for complex programmable logic tasks while keeping board-level BOM and external memory requirements under control.
Engineers targeting robust embedded systems, industrial automation, or dense I/O platforms will find this device well suited to scalable designs that demand reliable operation across a wide temperature range.
Request a quote or submit a procurement inquiry today to evaluate the 5AGZME1E2H29I3LN for your next design.

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