5AGZME1E2H29I3LG

IC FPGA 342 I/O 780HBGA
Part Description

Arria V GZ Field Programmable Gate Array (FPGA) IC 342 15282176 220000 780-BBGA, FCBGA

Quantity 28 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O342Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs10377Number of Logic Elements/Cells220000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits15282176

Overview of 5AGZME1E2H29I3LG – Arria V GZ FPGA, approximately 220,000 logic elements, ~15.3 Mbits RAM, 342 I/Os

The 5AGZME1E2H29I3LG is an Intel Arria V GZ Field Programmable Gate Array (FPGA) supplied in a surface-mount, 780-ball BGA package. This industrial-grade device combines a high count of programmable logic with multi-megabit embedded RAM and a broad I/O complement to support complex digital integration in systems that require extended operating temperature range.

Designed for applications that need dense logic resources, substantial on-chip memory, and numerous external interfaces, the device delivers a programmable platform for system integration, prototyping, and industrial deployments operating from -40 °C to 100 °C.

Key Features

  • Logic Capacity — Approximately 220,000 logic elements to implement complex digital logic and custom processing pipelines.
  • Embedded Memory — Approximately 15.3 Mbits of on-chip RAM for buffering, lookup tables, and state storage within the FPGA fabric.
  • I/O Density — 342 general-purpose I/O pins to support multiple interfaces, high-pin-count connectivity, and cross-domain signaling.
  • Voltage Supply — Core voltage supply range of 820 mV to 880 mV, enabling defined power design for the FPGA core.
  • Package & Mounting — 780-ball BGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33). Surface-mount mounting type for PCB integration.
  • Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C and classified as Industrial grade for use in temperature-challenged environments.
  • RoHS Compliant — Meets RoHS requirements for environmental compliance.

Typical Applications

  • Industrial control and automation — Industrial-grade temperature range and high logic capacity enable control algorithms, state machines, and I/O aggregation in factory and process-control equipment.
  • High-density digital systems — Large logic element count and multi-megabit embedded RAM support consolidation of multiple digital functions onto a single FPGA fabric.
  • Interface bridging and I/O expansion — 342 I/Os allow implementation of protocol bridging, custom bus interfaces, and high-pin-count peripheral connectivity.

Unique Advantages

  • Substantial programmable capacity: Approximately 220,000 logic elements provide the headroom to integrate complex logic and multiple concurrent functions on one device.
  • Significant on-chip memory: Approximately 15.3 Mbits of embedded RAM reduces external memory dependence and simplifies buffering and local data storage.
  • High I/O count: 342 I/Os enable flexible system-level connections and support for diverse interface requirements without external multiplexing.
  • Industrial robustness: Rated for -40 °C to 100 °C operation, making the device suitable for deployed industrial systems that require extended temperature range.
  • Board-level integration: Surface-mount 780-ball BGA packaging supports compact, high-density PCB designs and standard assembly processes.
  • Regulatory compliance: RoHS compliance supports environmentally conscious product builds and supply-chain requirements.

Why Choose 5AGZME1E2H29I3LG?

The 5AGZME1E2H29I3LG Arria V GZ FPGA offers a balanced combination of large programmable logic capacity, multi-megabit embedded memory, and a high I/O count packaged for surface-mount integration. Its industrial temperature rating and defined core voltage range make it appropriate for systems that require reliable operation across a wide temperature span and well-defined power design.

This device is well suited to designers who need to consolidate functions, implement custom interfaces, or build flexible, reprogrammable hardware platforms where on-chip resources and a high number of I/Os reduce external component count and simplify system architecture.

Request a quote or submit a procurement inquiry to evaluate 5AGZME1E2H29I3LG for your next industrial FPGA design project.

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