5AGZME1E2H29C3N

The 5AGZME1E2H29C3N is an Intel Arria V GZ field-programmable gate array (FPGA) supplied in a 780-ball BGA surface-mount package. It delivers substantial logic capacity and on-chip memory in a commercial-grade device targeted at complex embedded and system-level designs.

With 220,000 logic elements, approximately 15.3 Mbits of embedded memory and 342 user I/Os, this FPGA is suited for projects that require high integration density, flexible I/O, and a compact board footprint while operating within a core voltage range of 820 mV to 880 mV.

Key Features

• Logic Capacity — 220,000 logic elements for implementing complex combinational and sequential logic.
• Embedded Memory — Approximately 15.3 Mbits of on-chip RAM (15,282,176 bits) for data buffering, state storage, and intermediate processing.
• I/O Density — 342 programmable I/O pins to support multi-channel interfacing and parallel signal routing.
• Package and Mounting — Surface-mount 780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33) for compact system integration.
• Power Supply — Core voltage operational range from 820 mV to 880 mV to match modern low-voltage power domains.
• Grade and Temperature — Commercial-grade device rated for 0°C to 85°C operation.
• Compliance — RoHS-compliant manufacturing.
• Documentation — Supported by the Arria V GZ device datasheet, which includes electrical, switching, configuration, and I/O timing specifications.

Typical Applications

• Data Processing and Acceleration — Large logic capacity and on-chip RAM make the device suitable for hardware acceleration and custom datapath implementations.
• Interface-Intensive Systems — The 342 I/O pins enable multi-port connectivity for board-level bridging, protocol aggregation, and parallel I/O tasks.
• Embedded Control and Signal Processing — High logic density and embedded memory support complex control algorithms, DSP pipelines, and real-time processing functions.

Unique Advantages

• High Integration Density: 220,000 logic elements allow consolidation of multiple functions into a single device, reducing system BOM and board space.
• Substantial On-Chip Memory: Approximately 15.3 Mbits of embedded RAM provides on-device storage for buffering, LUT-based storage, and state machinery.
• Expanded I/O Capability: 342 I/Os accommodate broad interfacing needs without requiring external multiplexing logic.
• Compact BGA Package: 780-ball FCBGA (33×33) packaging enables dense placement in space-constrained designs while supporting surface-mount assembly.
• Commercial Temperature Range: Rated for 0°C to 85°C, matching typical commercial electronic applications.
• RoHS Compliance: Environmentally compliant manufacturing aligns with standard supply-chain requirements.

Why Choose 5AGZME1E2H29C3N?

The 5AGZME1E2H29C3N Arria V GZ FPGA positions itself as a high-density, commercially rated solution for designs that require extensive programmable logic, significant on-chip memory, and a large number of I/O lines in a compact BGA footprint. Its documented electrical and configuration specifications in the Arria V GZ device datasheet support engineers in integrating the device into system-level designs with predictable operating conditions.

This FPGA is well suited for engineering teams and procurement specialists pursuing scalable, integration-focused designs where logic density, embedded memory, and I/O count are key selection criteria, backed by Intel’s Arria V family documentation.

Request a quote or submit an RFQ to receive pricing, availability, and lead-time information for the 5AGZME1E2H29C3N Arria V GZ FPGA.