5AGXMB7G6F35C6N

The 5AGXMB7G6F35C6N is an Intel Arria V GX field programmable gate array (FPGA) supplied in a 1152-BBGA exposed-pad FCBGA package for surface-mount assembly. It delivers a high logic capacity and abundant I/O in a commercial-grade device.

With 504,000 logic elements and approximately 27.7 Mbits of embedded RAM, this device is targeted at designs that require dense logic integration, substantial on-chip memory, and a high pin count, while operating within standard commercial temperature and supply ranges.

Key Features

• Core Logic Capacity — 504,000 logic elements (cells) to support large-scale programmable logic implementations.
• Embedded Memory — Approximately 27.7 Mbits of on-chip RAM for buffering, LUT-based storage, and memory-mapped functions.
• I/O Density — 544 user I/O pins to accommodate wide bus interfaces and multiple external peripherals.
• Power and Voltage — Core voltage supply specified between 1.07 V and 1.13 V, enabling predictable power delivery design.
• Package & Mounting — 1152-BBGA, FCBGA exposed pad package (supplier device package: 1152-FBGA, 35×35 mm) with surface-mount mounting for compact board layouts and thermal contact.
• Operating Conditions — Commercial-grade device rated for 0°C to 85°C ambient operation.
• Standards Compliance — RoHS compliant, supporting regulatory-driven designs.
• Documented Device Characteristics — Detailed electrical, switching, configuration, and I/O timing specifications are provided in the Arria V device datasheet for GX-class devices.

Typical Applications

• I/O-Intensive Systems — Use the 544 I/O pins for designs that require multiple parallel interfaces, wide buses, or extensive sensor and peripheral connectivity.
• Memory-Centric Logic — Leverage approximately 27.7 Mbits of embedded RAM for buffering, packet storage, or local data processing without external memory.
• High-Logic-Density Designs — Deploy the 504,000 logic elements for complex finite-state machines, large combinatorial logic, or intensive control logic integration.
• Compact Surface-Mount Products — The 1152-BBGA exposed-pad FCBGA package supports compact PCB layouts with a thermal interface for efficient board-level heat dissipation.

Unique Advantages

• High Integration Density: 504,000 logic elements and substantial on-chip RAM reduce the need for external ASICs or discrete logic, simplifying BOM and board area.
• Generous I/O Count: 544 I/O pins enable multiple parallel interfaces and flexible system partitioning without external I/O expanders.
• Compact, Thermally Accessible Package: The exposed-pad 1152-BBGA FCBGA package facilitates thermal management in compact designs.
• Predictable Power Envelope: A defined supply range of 1.07 V to 1.13 V assists in power-supply design and system-level power budgeting.
• Commercial Temperature Qualified: Rated for 0°C to 85°C operation to meet standard commercial deployment requirements.
• Regulatory Compliance: RoHS compliance supports environmentally driven procurement and product requirements.

Why Choose 5AGXMB7G6F35C6N?

The 5AGXMB7G6F35C6N Arria V GX FPGA delivers a balance of high logic capacity, sizable embedded memory, and a large I/O complement in a surface-mount FCBGA package. Its specification set—504,000 logic elements, approximately 27.7 Mbits of on-chip RAM, 544 I/O, and a defined supply and temperature window—makes it a straightforward choice for commercial designs that demand dense programmable logic and extensive external connectivity.

Choose this device when your design requires significant on-chip resources, clear electrical and timing documentation, and RoHS compliance. It is well suited for engineering teams and procurement focused on scalable, high-density programmable solutions backed by documented device characteristics in the Arria V datasheet.

Request a quote or submit an inquiry to obtain pricing, availability, and technical support for the 5AGXMB7G6F35C6N Arria V GX FPGA.