5AGZME1E2H29C3G
| Part Description |
Arria V GZ Field Programmable Gate Array (FPGA) IC 342 15282176 220000 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,083 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 342 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 10377 | Number of Logic Elements/Cells | 220000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 15282176 |
Overview of 5AGZME1E2H29C3G – Arria V GZ Field Programmable Gate Array (FPGA)
The 5AGZME1E2H29C3G is an Arria V GZ family Field Programmable Gate Array (FPGA) in a 780‑BBGA FCBGA package. It delivers a high-capacity programmable fabric with 220,000 logic elements and approximately 15.3 Mbits of embedded memory for mid-to-high density FPGA designs.
Designed for commercial-grade applications, this surface-mount FPGA integrates a large I/O count and a focused core voltage range to support tightly constrained power and system-level requirements.
Key Features
- Core logic capacity: 220,000 logic elements provide substantial programmable resources for complex logic integration and custom IP implementation.
- Embedded memory: Approximately 15.3 Mbits of on-chip RAM (15,282,176 bits) for buffering, frame storage, and embedded data structures.
- I/O density: 342 dedicated I/O pins to support wide external interfacing and multi-protocol connectivity.
- Package & mounting: 780‑BBGA FCBGA package (supplier device package: 780‑HBGA, 33×33) optimized for surface-mount assembly.
- Power supply range: Core voltage supply specified from 820 mV to 880 mV to meet targeted power-design margins.
- Operating conditions: Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Design resource count: 10,377 logic array blocks (as reported), enabling structured placement of logic functions across the device.
- Compliance: RoHS compliant.
Unique Advantages
- Substantial programmable capacity: 220,000 logic elements and ~15.3 Mbits of embedded RAM allow integration of complex algorithms and moderate on-chip data storage without external memory.
- High I/O count: 342 I/O pins let designers implement broad external interfaces and parallel data paths without immediate need for I/O expanders.
- Compact BGA package: The 780‑BBGA (33×33) surface-mount package supports dense PCB layouts while maintaining accessibility to many I/Os.
- Controlled core power: A specified core voltage window (820–880 mV) facilitates predictable power budgeting and thermal planning.
- Commercial temperature grade: Rated 0 °C to 85 °C for projects targeting standard commercial environments.
- Regulatory readiness: RoHS compliance assists in meeting common environmental and procurement requirements.
Why Choose 5AGZME1E2H29C3G?
The 5AGZME1E2H29C3G Arria V GZ FPGA combines a large logic fabric with significant on-chip memory and a high I/O count in a compact 780‑BBGA FCBGA package. Its commercial-grade rating and defined core voltage range make it suitable for designs that require predictable power and thermal behavior within typical commercial environments.
Choose this device when you need a scalable, programmable solution that consolidates logic, memory, and I/O in a single package—helping reduce board-level complexity and streamline integration during development and production.
Request a quote or submit an inquiry to receive pricing and availability for the 5AGZME1E2H29C3G Arria V GZ FPGA. Technical procurement teams can also request additional specification details and ordering information.

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