5AGZME1E2H29C3G

IC FPGA 342 I/O 780HBGA
Part Description

Arria V GZ Field Programmable Gate Array (FPGA) IC 342 15282176 220000 780-BBGA, FCBGA

Quantity 1,083 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O342Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs10377Number of Logic Elements/Cells220000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits15282176

Overview of 5AGZME1E2H29C3G – Arria V GZ Field Programmable Gate Array (FPGA)

The 5AGZME1E2H29C3G is an Arria V GZ family Field Programmable Gate Array (FPGA) in a 780‑BBGA FCBGA package. It delivers a high-capacity programmable fabric with 220,000 logic elements and approximately 15.3 Mbits of embedded memory for mid-to-high density FPGA designs.

Designed for commercial-grade applications, this surface-mount FPGA integrates a large I/O count and a focused core voltage range to support tightly constrained power and system-level requirements.

Key Features

  • Core logic capacity: 220,000 logic elements provide substantial programmable resources for complex logic integration and custom IP implementation.
  • Embedded memory: Approximately 15.3 Mbits of on-chip RAM (15,282,176 bits) for buffering, frame storage, and embedded data structures.
  • I/O density: 342 dedicated I/O pins to support wide external interfacing and multi-protocol connectivity.
  • Package & mounting: 780‑BBGA FCBGA package (supplier device package: 780‑HBGA, 33×33) optimized for surface-mount assembly.
  • Power supply range: Core voltage supply specified from 820 mV to 880 mV to meet targeted power-design margins.
  • Operating conditions: Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Design resource count: 10,377 logic array blocks (as reported), enabling structured placement of logic functions across the device.
  • Compliance: RoHS compliant.

Unique Advantages

  • Substantial programmable capacity: 220,000 logic elements and ~15.3 Mbits of embedded RAM allow integration of complex algorithms and moderate on-chip data storage without external memory.
  • High I/O count: 342 I/O pins let designers implement broad external interfaces and parallel data paths without immediate need for I/O expanders.
  • Compact BGA package: The 780‑BBGA (33×33) surface-mount package supports dense PCB layouts while maintaining accessibility to many I/Os.
  • Controlled core power: A specified core voltage window (820–880 mV) facilitates predictable power budgeting and thermal planning.
  • Commercial temperature grade: Rated 0 °C to 85 °C for projects targeting standard commercial environments.
  • Regulatory readiness: RoHS compliance assists in meeting common environmental and procurement requirements.

Why Choose 5AGZME1E2H29C3G?

The 5AGZME1E2H29C3G Arria V GZ FPGA combines a large logic fabric with significant on-chip memory and a high I/O count in a compact 780‑BBGA FCBGA package. Its commercial-grade rating and defined core voltage range make it suitable for designs that require predictable power and thermal behavior within typical commercial environments.

Choose this device when you need a scalable, programmable solution that consolidates logic, memory, and I/O in a single package—helping reduce board-level complexity and streamline integration during development and production.

Request a quote or submit an inquiry to receive pricing and availability for the 5AGZME1E2H29C3G Arria V GZ FPGA. Technical procurement teams can also request additional specification details and ordering information.

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