5AGZME1H2F35C3G

The 5AGZME1H2F35C3G is an Arria V GZ family FPGA in a 1152‑ball FCBGA (35×35) package designed for surface‑mount assembly. It provides 220,000 logic elements and approximately 15.3 Mbits of embedded on‑chip RAM with 414 user I/Os, delivering high capacity for large programmable logic designs.

Rated for commercial operation (0 °C to 85 °C) and RoHS compliant, this device targets designs that require substantial logic density, extensive on‑chip memory, and broad I/O counts within a compact BGA footprint. The device operates from a core supply in the 820 mV to 880 mV range.

Key Features

• Logic Capacity — 220,000 logic elements to implement complex state machines, datapaths, and logic-intensive functions.
• Embedded Memory — Approximately 15.3 Mbits of on‑chip RAM for buffering, LUT RAM, and embedded storage to support large datasets and pipelines.
• I/O Density — 414 user I/Os to enable wide bus interfaces, parallel connections, and multiple peripheral links.
• Package & Mounting — 1152‑BBGA (FCBGA), supplier package 1152‑FBGA (35×35); surface‑mount device suitable for compact system boards.
• Power Supply — Core voltage supply specification between 820 mV and 880 mV to match system power planning requirements.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for standard industrial and consumer environments.
• Standards & Compliance — RoHS compliant for regulatory and environmental conformity.
• Documented Configuration & Timing — Device family datasheet includes configuration specifications, I/O timing, and electrical characteristics to support integration and verification.

Typical Applications

• High‑density programmable logic systems — Implement large custom logic engines and complex control/state machines using 220,000 logic elements and extensive on‑chip RAM.
• Data buffering and packet processing — Approximately 15.3 Mbits of embedded memory supports streaming buffers and packet queues for communications or data‑flow applications.
• Multi‑interface aggregation — 414 I/Os enable aggregation of parallel buses, peripheral interfaces, and board‑level connectivity in compact designs.

Unique Advantages

• High logic and memory density: 220,000 logic elements combined with ~15.3 Mbits of RAM supports complex algorithms and large datasets on a single device, reducing external memory dependencies.
• Broad I/O count: 414 user I/Os allow flexible interfacing to multiple subsystems without immediate need for expansion devices.
• Compact BGA package: 1152‑BBGA (35×35) delivers high pin‑count in a compact footprint for space‑constrained boards.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with standard production and consumer system environments.
• Regulatory readiness: RoHS compliance supports environmentally regulated product designs.
• Well‑documented family specifications: Arria V device datasheet coverage for electrical, configuration, and I/O timing details aids design integration and validation.

Why Choose 5AGZME1H2F35C3G?

This Arria V GZ FPGA balances significant logic and embedded memory capacity with a high I/O count in a single, surface‑mount 1152‑ball FCBGA package, making it suitable for systems that need concentrated programmable resources in a compact board area. Its commercial temperature rating and RoHS compliance make it appropriate for a wide range of production designs.

Designers seeking to consolidate logic, buffering, and interfacing into a single programmable device will find the 5AGZME1H2F35C3G attractive for reducing BOM complexity and supporting scalable, verifiable FPGA implementations backed by the Arria V family documentation.

Please request a quote or submit a procurement inquiry to obtain pricing, availability, and lead‑time information for the 5AGZME1H2F35C3G.