5AGZME1H2F35I3LN

The 5AGZME1H2F35I3LN is an Arria V GZ series Field Programmable Gate Array (FPGA) from Intel, supplied in a 1152-ball BGA package. It delivers a high logic capacity FPGA fabric combined with substantial embedded RAM and a large I/O count for programmable system implementations in industrial environments.

Designed for surface-mount deployment, this industrial-grade device supports a core voltage supply range of 820 mV to 880 mV and an operating temperature range of -40 °C to 100 °C, making it suitable for systems that require extended temperature operation and robust integration of programmable logic and I/O.

Key Features

• Logic Capacity – 220,000 logic elements (cells) for implementing complex combinational and sequential logic functions.
• Embedded Memory – Approximately 15.3 Mbits of on-chip RAM to support data buffering, FIFOs, and state storage within the FPGA fabric.
• I/O Resources – 414 user I/O pins to interface with peripherals, sensors, and external devices.
• Packaging and Mounting – 1152-BBGA (FCBGA) 35×35 supplier package in a surface-mount format for compact board-level integration.
• Power and Voltage – Core voltage supply specified from 820 mV to 880 mV to match system power-rail planning and decoupling strategies.
• Industrial Temperature Rating – Rated to operate from -40 °C to 100 °C for use in temperature-challenging installations.
• Regulatory Compliance – RoHS compliant.

Typical Applications

• Industrial Control and Automation – Use the device to implement programmable control logic, signal conditioning interfaces, and I/O aggregation in factory and process-control systems where extended temperature range and industrial grade components are required.
• Embedded System Integration – Integrate custom logic blocks, memory buffers, and broad I/O connectivity for embedded platforms that need flexible hardware acceleration and I/O expansion.
• Communications and Data Path Processing – Deploy the FPGA fabric and on-chip memory to handle protocol bridging, data buffering, and parallel processing functions in communication equipment and test systems.

Unique Advantages

• High Logic Density: 220,000 logic elements provide the capacity to consolidate multiple functions on a single device, reducing board-level component count.
• Substantial On-Chip Memory: Approximately 15.3 Mbits of embedded RAM enables local buffering and state storage, simplifying external memory requirements.
• Extensive I/O Count: 414 I/Os allow flexible interfacing to sensors, peripherals, and high-density connectors without additional I/O expanders.
• Industrial Temperature Range: Rated from -40 °C to 100 °C for reliable operation in harsh or temperature-variable environments.
• Compact Surface-Mount Package: 1152-BBGA (35×35) FCBGA packaging supports high-density PCB layouts while maintaining strong connectivity and thermal characteristics.
• Regulatory Readiness: RoHS compliant to meet common environmental and procurement requirements.

Why Choose 5AGZME1H2F35I3LN?

The 5AGZME1H2F35I3LN Arria V GZ FPGA combines a high logic element count, substantial embedded RAM, and a broad I/O complement in an industrial-grade, surface-mount package. Its defined core voltage range and extended operating temperature make it well suited to applications that require programmable hardware flexibility under challenging environmental conditions.

This device is appropriate for engineers and system designers seeking to consolidate functions, implement custom accelerators or protocol logic, and maintain a compact board footprint while leveraging Intel’s Arria V family electrical and configuration specifications.

Request a quote or submit a sales inquiry to evaluate 5AGZME1H2F35I3LN for your next design and to obtain pricing, lead time, and availability information.