5AGZME3E2H29I3LN

The 5AGZME3E2H29I3LN is an Intel Arria V GZ field programmable gate array (FPGA) in an industrial-grade configuration. It provides a high-density programmable fabric with 360,000 logic elements and approximately 24 Mbits of embedded memory, making it suitable for designs that require substantial on-chip logic and RAM.

With 342 I/O pins, a compact 780-BBGA FCBGA package, and an industrial operating range of −40 °C to 100 °C, this device targets applications that need high integration, significant I/O capacity, and robust thermal performance. The device operates from a core supply between 820 mV and 880 mV and is RoHS compliant.

Key Features

• Core & Logic High-density programmable fabric with 360,000 logic elements for large-scale custom logic implementations.
• Embedded Memory Approximately 24 Mbits of on-chip RAM to support data buffering, lookup tables, and local storage without external memory.
• I/O & Periphery 342 general-purpose I/O pins to support complex interfacing and high pin-count system requirements.
• Package & Mounting 780-BBGA (FCBGA) package, supplier device package listed as 780-HBGA (33×33), optimized for surface-mount assembly.
• Power & Voltage Core voltage supply range from 820 mV to 880 mV for regulated low-voltage core operation.
• Temperature & Grade Industrial grade device rated for operation from −40 °C to 100 °C for demanding thermal environments.
• Compliance RoHS compliant for global environmental regulatory conformance.

Typical Applications

• Industrial Control Systems High logic density and industrial temperature rating make it suitable for control, automation, and PLC subsystems that require robust on-board processing.
• High-density I/O Processing 342 I/O pins enable systems that must aggregate or route many signals, such as data concentrators and interface bridging.
• Embedded System Integration Large on-chip RAM and logic count support integration of custom accelerators, protocol handlers, and data-path logic within a single device.

Unique Advantages

• High Logic Capacity: 360,000 logic elements allow implementation of complex, large-scale FPGA designs without external partitioning.
• Substantial On-Chip Memory: Approximately 24 Mbits of embedded RAM reduces dependency on external memory for many buffering and lookup requirements.
• Extensive I/O Count: 342 I/O pins provide the flexibility to connect numerous peripherals, sensors, or high-speed interfaces.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to meet the demands of thermally challenging deployments.
• Compact FCBGA Packaging: 780-BBGA (33×33 HBGA footprint) balances high pin count with a compact board area for space-constrained designs.
• Low Core Voltage Operation: Core supply range of 820 mV–880 mV supports low-power core domains when integrated into system power architectures.

Why Choose 5AGZME3E2H29I3LN?

The 5AGZME3E2H29I3LN Arria V GZ FPGA combines high logic density, significant embedded memory, and a large I/O complement in an industrial-grade, surface-mount FCBGA package. It is well suited for designers building integrated, high-functionality systems that require substantial on-chip resources and reliable operation across a wide temperature range.

Documentation for the Arria V GZ family is available to guide electrical, configuration, and timing integration, helping teams move from design to deployment with clear device specifications.

Request a quote or submit a sales inquiry to get pricing, availability, and additional procurement details for the 5AGZME3E2H29I3LN Arria V GZ FPGA.