5AGZME3E3H29C4G

The 5AGZME3E3H29C4G is an Intel Arria V GZ family FPGA offered in a 780-ball FCBGA package for surface-mount board-level integration. It provides high logic capacity, abundant embedded memory, and extensive I/O for complex custom logic and system integration in commercial applications.

Key electrical and environmental parameters in the product data include a core supply range of 820 mV to 880 mV, an operating temperature range of 0 °C to 85 °C, and RoHS compliance.

Key Features

• Core Logic Density — 360,000 logic elements (cells) to implement large-scale FPGA designs and complex custom logic.
• Embedded Memory — Approximately 24 Mbits of on-chip RAM (23,946,240 bits) to support buffering, state storage, and memory-intensive functions.
• I/O Capacity — 342 user I/Os to interface with multiple peripherals, buses, and high-pin-count system designs.
• Package & Mounting — 780-BBGA (FCBGA) surface-mount package; supplier package listed as 780-HBGA (33×33) for compact, board-level assembly.
• Power Requirements — Core voltage supply specified between 820 mV and 880 mV for power planning and regulator selection.
• Commercial Grade Operation — Rated for commercial temperature operation from 0 °C to 85 °C.
• Configuration Options — Datasheet indicates support and timing information for common FPGA configuration schemes including JTAG, Fast Passive Parallel (FPP), Active Serial (AS), and Passive Serial (PS).
• Standards Compliance — RoHS compliant, supporting environmentally responsible designs.

Typical Applications

• High-density custom logic — Implement large-scale state machines, protocol engines, or custom compute blocks using 360,000 logic elements and abundant on-chip RAM.
• System I/O aggregation — Aggregate and bridge multiple interfaces or bus standards using 342 user I/Os for system-level integration.
• Prototyping and development platforms — Use the Arria V GZ device in commercial development systems requiring significant logic and memory resources within a compact BGA footprint.

Unique Advantages

• High logic capacity: 360,000 logic elements reduce the need for multi-device partitioning in complex designs.
• Substantial embedded memory: Approximately 24 Mbits of on-chip RAM enables large buffers, FIFOs, and local storage without external memory in many designs.
• Extensive I/O: 342 I/Os provide flexibility for dense peripheral connectivity and multi-channel designs.
• Compact BGA package: 780-ball FCBGA (33×33 supplier package) supports compact board layouts while maintaining high pin-count connectivity.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with a wide range of commercial deployments.
• Configuration flexibility: Multiple supported configuration schemes (JTAG, FPP, AS, PS) simplify integration into varied production and programming workflows.

Why Choose 5AGZME3E3H29C4G?

The 5AGZME3E3H29C4G Arria V GZ FPGA combines large logic density, significant embedded memory, and a high I/O count in a compact 780-ball FCBGA package—making it a fit for commercial designs that demand on-chip resources and board-level integration. Its documented operating ranges and configuration options provide the data needed for power, thermal, and system-level planning.

Engineers and procurement teams looking for a commercially rated, RoHS-compliant Arria V device with detailed electrical and configuration specifications in the available datasheet will find this part suitable for designs that require consolidation of functions into a single, high-capacity FPGA.

Request a quote or submit your specification needs to receive pricing and availability for the 5AGZME3E3H29C4G Arria V GZ FPGA.