5AGZME3H2F35C3G

The 5AGZME3H2F35C3G is an Arria V GZ field programmable gate array (FPGA) in a 1152‑BBGA FCBGA package. It delivers high logic density with a large on‑chip memory complement and substantial I/O count for dense, reconfigurable digital designs.

Targeted at commercial applications, this device provides a balance of programmable logic capacity, embedded memory, and I/O capability while operating within a core supply range of 820 mV to 880 mV and a commercial temperature range of 0 °C to 85 °C.

Key Features

• High Logic Density — Approximately 360,000 logic elements to implement complex digital functions and large-scale logic fabrics.
• Embedded Memory — Approximately 24 Mbits of on‑chip RAM to support buffering, packet processing, and local data storage.
• Rich I/O — 414 user I/O pins to support dense external interfaces and multi‑lane connectivity.
• Package and Mounting — Available in a 1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA (35×35). Surface‑mount design suitable for standard PCB assembly.
• Power and Operating Range — Core voltage supply range of 820 mV to 880 mV for core domain power planning and a commercial operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS‑compliant construction for regulatory environmental requirements.
• Commercial Grade — Supplied as a commercial‑grade Arria V device (speed grade indicated by part numbering).

Typical Applications

• High‑density digital processing — Use the device’s large logic element count and embedded memory for compute‑intensive FPGA implementations and custom accelerators.
• Multi‑interface bridging — Leverage 414 I/Os to aggregate and bridge multiple external interfaces or protocol domains on a single device.
• Prototyping and development platforms — Employ the Arria V GZ device for system prototyping where reconfigurable logic and significant on‑chip memory are required.
• Embedded system integration — Integrate programmable logic, memory, and I/O to implement subsystem functions within larger electronic products.

Unique Advantages

• Large programmable fabric: Approximately 360,000 logic elements enable complex logic implementations without external CPLDs or additional FPGAs.
• Substantial on‑chip memory: Approximately 24 Mbits of embedded RAM reduces dependency on external memory for many buffering and caching tasks.
• High I/O count: 414 I/Os support high‑pin‑count boards and dense peripheral interfacing, simplifying system routing and integration.
• Package density: 1152‑BBGA (35×35) package provides a compact surface‑mount option for space‑constrained PCBs.
• Commercial operating window: Designed for 0 °C to 85 °C operation and RoHS compliance to fit standard commercial product requirements.

Why Choose 5AGZME3H2F35C3G?

The 5AGZME3H2F35C3G Arria V GZ FPGA combines high logic capacity, sizeable embedded memory, and a large I/O complement in a compact 1152‑BBGA package. These characteristics make it suitable for designs that require significant on‑chip resources and flexible interfacing while maintaining commercial operating conditions and RoHS compliance.

Engineers and product teams seeking a commercial‑grade reconfigurable device with predictable power and thermal operating ranges will find this Arria V GZ part a practical choice for mid‑to‑high complexity FPGA designs that must balance density, memory, and I/O integration.

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