5AGZME3H2F35I3LG

The 5AGZME3H2F35I3LG is an Intel Arria V GZ field programmable gate array (FPGA) supplied in an industrial-grade package. This device delivers a high density of programmable logic, on-chip memory, and I/O resources suitable for designs that require substantial logic capacity and robust operating-range characteristics.

Key architectural highlights include 360,000 logic elements, approximately 24 Mbits of embedded memory, and 414 user I/O pins, all packaged in a 1152-ball FCBGA (35 × 35 mm) surface-mount package. The device operates with a core supply range of 820 mV to 880 mV and is rated for operation from −40 °C to 100 °C.

Key Features

• Logic Capacity — 360,000 logic elements for large-scale programmable logic integration and complex design implementation.
• Embedded Memory — Approximately 24 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without heavy external memory reliance.
• I/O Density — 414 user I/O pins to interface with a wide range of peripherals, sensors, and external devices.
• Package — 1152-ball BGA, FCBGA footprint (supplier package: 1152-FBGA, 35 × 35 mm) optimized for high pin-count, surface-mount board designs.
• Power and Core Voltage — Core supply specified from 820 mV to 880 mV to match platform power-rail requirements.
• Industrial Temperature Rating — Operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
• Mounting and Compliance — Surface-mount package with RoHS compliance for environmental regulatory alignment.

Typical Applications

• Industrial Control: Deploy in motor control, PLC, and factory automation systems where industrial-grade temperature range and high logic capacity enable complex control algorithms and signal processing.
• Communications Infrastructure: Use the device’s logic density and on-chip RAM for packet processing, protocol implementation, and custom datapath acceleration.
• High-density I/O Systems: Integrate with multi-channel I/O subsystems, sensor arrays, or data acquisition front-ends that benefit from 414 available I/O pins.

Unique Advantages

• High Logic Integration: 360,000 logic elements reduce the need for multiple discrete components, enabling more compact and integrated system designs.
• Substantial On-chip Memory: Approximately 24 Mbits of embedded RAM supports buffering and stateful processing without excessive external memory.
• Robust I/O Count: 414 I/O pins provide flexibility for complex interfacing, simplifying board-level signal routing and peripheral connections.
• Industrial-ready Thermal Range: Rated for −40 °C to 100 °C operation, supporting deployment in harsh and temperature-variable environments.
• Compact, High-pin Package: 1152-ball FCBGA (35 × 35 mm) balances high pin count with a compact footprint for space-constrained PCBs.
• Regulatory Compliance: RoHS-compliant construction supports environmental and regulatory requirements for commercial and industrial products.

Why Choose 5AGZME3H2F35I3LG?

The 5AGZME3H2F35I3LG Arria V GZ FPGA combines high logic density, sizable embedded RAM, and extensive I/O in an industrial-rated, surface-mount 1152-ball FCBGA package. These attributes make it well suited for engineers developing complex, high-performance programmable logic solutions where integration density, operating temperature range, and I/O count are key selection criteria.

Selecting this FPGA supports scalable designs that demand substantial on-chip resources and reliable operation across a wide temperature range, while maintaining compliance with RoHS standards.

Request a quote or submit an inquiry to receive pricing and availability information for 5AGZME3H2F35I3LG. Our team can provide detailed lead-time and ordering support tailored to your project requirements.