5AGZME3H2F35C3N

The 5AGZME3H2F35C3N is an Arria V GZ Field Programmable Gate Array (FPGA) IC provided in a 1152-BBGA (FCBGA) surface-mount package. It offers a large logic fabric—360,000 logic elements—and substantial on-chip memory capacity, making it suitable for designs that require significant programmable logic and embedded RAM within a commercial-temperature device.

This device is supplied with a documented Arria V GZ device datasheet that details electrical characteristics, switching parameters, configuration timing, and I/O timing to support system integration and design validation.

Key Features

• Logic Capacity  360,000 logic elements to implement complex programmable logic and custom digital functions.
• Embedded Memory  Approximately 24 Mbits of on-chip RAM (23,946,240 total RAM bits) for data buffering, state storage, and memory-intensive logic.
• I/O Density  414 I/O pins to support extensive peripheral connectivity and multi-channel interfacing.
• Core Voltage  Specified core voltage range of 820 mV to 880 mV to match target power architectures.
• Package & Mounting  1152-BBGA / 1152-FBGA (35 × 35) FCBGA supplier package in a surface-mount form factor for compact board integration.
• Thermal & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant for environmental and regulatory alignment.
• Documentation  Arria V GZ device datasheet included, covering electrical characteristics, switching characteristics, configuration specifications, and I/O timing to aid design and verification.

Typical Applications

• High-density programmable logic  Implement custom digital functions and state machines that require large logic capacity and embedded RAM.
• Multi-interface systems  Aggregate and bridge multiple peripheral interfaces using the device’s 414 I/Os for flexible board-level connectivity.
• Prototyping and development  Use the Arria V GZ device for design validation and prototyping where significant logic resources and documented electrical/spec timing are required.
• Embedded memory buffering  Leverage approximately 24 Mbits of on-chip RAM for buffering, packet storage, or intermediate data handling in custom logic designs.

Unique Advantages

• Substantial logic resource: 360,000 logic elements enable implementation of large, complex designs without immediate partitioning.
• Significant embedded RAM: Approximately 24 Mbits of on-chip memory reduces external-memory dependency for many applications.
• High I/O count: 414 I/O pins provide flexibility for connecting multiple sensors, interfaces, or parallel data lanes.
• Compact, production-ready package: 1152-BBGA (35 × 35) FCBGA surface-mount package supports dense board layouts and industrial manufacturing flows.
• Commercial operating range and RoHS compliance: Suitable for standard commercial products and compliant with RoHS environmental requirements.
• Detailed device documentation: Comprehensive Arria V GZ datasheet covers electrical, switching, configuration, and I/O timing necessary for system integration.

Why Choose 5AGZME3H2F35C3N?

The 5AGZME3H2F35C3N Arria V GZ FPGA is positioned for designers who need a large FPGA fabric with considerable embedded memory and extensive I/O in a compact BGA package. Its documented electrical and timing specifications support rigorous integration and verification efforts for commercial-temperature applications.

Choose this device when your design requires substantial programmable logic, on-chip RAM capacity, and a high pin count in a surface-mount 1152-BBGA package with RoHS compliance and full datasheet coverage.

Request a quote or submit an inquiry today to obtain pricing, availability, and lead-time information for the 5AGZME3H2F35C3N Arria V GZ FPGA.