5AGZME5H2F35C3NCV

The 5AGZME5H2F35C3NCV is an Arria V GZ field programmable gate array (FPGA) IC designed for applications that require high logic capacity, significant on-chip memory, and extensive I/O connectivity. As a surface-mount FCBGA device in a 1152-BBGA (35×35) package, it delivers a balance of integration and board-level density for commercial-grade designs.

This FPGA targets designs that need substantial programmable logic and embedded memory while operating within a commercial temperature range and a tightly specified core voltage window. It is suitable for projects that prioritize logic density, embedded RAM, and broad I/O count in a compact ball-grid array package.

Key Features

• Logic Capacity — 400,000 logic elements, providing substantial programmable logic resources for complex designs.
• Embedded Memory — Approximately 34 Mbits of embedded memory (34,322,432 total RAM bits) to support large on-chip buffering and data storage.
• I/O Density — 534 I/O pins to accommodate extensive peripheral, interface, and routing requirements.
• Package and Mounting — 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) with surface-mount mounting for compact PCB integration.
• Power — Core voltage supply range of 820 mV to 880 mV to match designs requiring a specific low-voltage core domain.
• Operating Range — Commercial-grade operating temperature from 0 °C to 85 °C for standard commercial applications.
• Regulatory — RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• High-density digital systems — Use the abundant logic elements and embedded memory to implement complex custom logic, state machines, and data-paths on a single device.
• Multi-interface designs — Leverage 534 I/O pins to connect numerous peripherals, sensors, and communication interfaces without external multiplexing.
• Compact board-level solutions — The 1152-BBGA surface-mount package enables high integration in space-constrained commercial products.

Unique Advantages

• High programmable density: 400,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing component count.
• Substantial on-chip memory: Approximately 34 Mbits of embedded RAM supports buffering and intermediate storage, minimizing dependence on external memory.
• Extensive I/O: 534 I/O pins provide flexibility for complex interconnects and numerous interfaces directly from the FPGA.
• Compact BGA packaging: The 1152-BBGA (35×35) footprint offers a high-pin-count solution in a compact form factor for dense PCB layouts.
• Commercial temperature rating: Rated 0 °C to 85 °C to meet standard commercial-environment product requirements.
• RoHS compliant: Enables use in lead‑free manufacturing processes to meet common supply-chain requirements.

Why Choose 5AGZME5H2F35C3NCV?

The 5AGZME5H2F35C3NCV positions itself as a high-capacity, commercially rated FPGA that brings together significant programmable logic, embedded memory, and broad I/O in a compact 1152-ball BGA package. Its defined core voltage range and surface-mount footprint make it suitable for designs that demand dense integration and predictable electrical characteristics.

This device is a fit for designers and teams building commercial electronic products that need to consolidate complex logic functions, handle sizable on-chip data storage, and interface with many external signals while maintaining small PCB area and RoHS compliance. It offers a scalable hardware platform for mid- to high-complexity designs where on-chip resources and I/O are primary selection criteria.

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