5AGZME5H2F35C3N

The 5AGZME5H2F35C3N is an Intel Arria V GZ field-programmable gate array delivered in a 1152‑BBGA FCBGA package (supplier package: 1152‑FBGA, 35×35). It provides a high-density programmable fabric with 400,000 logic elements, approximately 34.32 Mbits of embedded RAM, and 534 dedicated I/O pins for complex system integration.

Designed for commercial‑grade applications, this surface‑mount FPGA operates from 0 °C to 85 °C and requires a core supply in the 820 mV to 880 mV range. It is RoHS compliant.

Key Features

• Logic Capacity  400,000 logic elements to implement complex custom logic, state machines, and datapaths.
• Embedded Memory  Approximately 34.32 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage.
• High I/O Count  534 I/O pins to support wide external interfaces and multiple parallel buses.
• Package & Mounting  1152‑BBGA FCBGA package (supplier: 1152‑FBGA, 35×35) in a surface‑mount form factor for dense board integration.
• Supply Voltage  Core supply operating range of 820 mV to 880 mV to match system power rails and performance targets.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for typical commercial applications.
• Environmental Compliance  RoHS compliant to meet standard material and environmental requirements.

Typical Applications

• Custom Digital Logic and Prototyping  Implement and iterate complex logic designs with high-density programmable resources.
• Data Path Acceleration  Use embedded RAM and large logic capacity to build custom datapaths, buffering, and protocol handling.
• High‑Pin‑Count Interfaces  Leverage 534 I/Os for wide parallel buses, sensor arrays, or multi‑interface bridging.

Unique Advantages

• Substantial Logic Resources: 400,000 logic elements enable large-scale integration of custom hardware functions on a single device.
• Significant On‑Chip Memory: Approximately 34.32 Mbits of embedded RAM reduces external memory dependence and improves performance for latency‑sensitive designs.
• Extensive I/O Reach: 534 I/O pins simplify board-level routing for systems that require many external connections.
• Compact FCBGA Packaging: The 1152‑BBGA (1152‑FBGA, 35×35) package supports dense PCB layouts while maintaining a surface‑mount footprint.
• Commercial Operating Range: Rated for 0 °C to 85 °C, matching common commercial product requirements.
• Regulatory Compliance: RoHS compliance eases material‑restriction requirements for manufacturing.

Why Choose 5AGZME5H2F35C3N?

The 5AGZME5H2F35C3N delivers a balance of high logic density, substantial embedded memory, and broad I/O capability in a compact surface‑mount FCBGA package. Its commercial temperature rating and controlled core voltage range make it suitable for a wide range of production systems that require programmable hardware integration without the need for external memory-heavy designs.

This FPGA is well suited to engineering teams and OEMs looking to consolidate discrete functions into programmable silicon, accelerate bespoke datapaths, and support complex interface requirements while maintaining RoHS compliance and a standardized commercial operating envelope.

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