5AGZME5H2F35I3LG

The 5AGZME5H2F35I3LG is an Intel Arria V GZ field-programmable gate array supplied in a 1152‑BBGA (35×35) package. It provides a high-density programmable fabric with 400,000 logic elements and approximately 34 Mbits of embedded memory, plus 18,870 CLBs and 534 user I/Os. This device is offered in an industrial grade variant and is suited to designs that require dense logic capacity, substantial on-chip memory, and large I/O counts.

Key Features

• Core Logic  Provides 400,000 logic elements organized across 18,870 CLBs to implement complex programmable logic and custom compute blocks.
• On‑Chip Memory  Approximately 34 Mbits of embedded RAM to support large buffering, LUT-based storage, and state machines.
• I/O Density  534 user I/O pins for extensive interfacing to external devices, sensors, and high‑density board-level connectivity.
• Package  1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA 35×35) optimized for compact, high‑pin‑count layouts and surface-mount assembly.
• Power Supply  Core voltage supply range specified from 820 mV to 880 mV for the FPGA core domain.
• Temperature Range  Industrial operating range from −40 °C to 100 °C for deployment in demanding environmental conditions.
• Mounting & Compliance  Surface-mount device construction with RoHS compliance for current environmental standards.

Typical Applications

• High‑density digital processing: Use the large logic element count and embedded memory to implement custom accelerators, data path pipelines, and complex state machines.
• I/O‑intensive systems: Leverage 534 I/Os for multi-channel sensor interfaces, protocol bridging, and board-level aggregation.
• Industrial control and automation: Industrial grade temperature range and robust package make this device suitable for factory automation, motor control logic, and process control systems.
• Compact, high‑pin‑count designs: The 1152‑BBGA package supports dense PCB routing in space-constrained assemblies requiring many signal and power connections.

Unique Advantages

• Large programmable fabric: 400,000 logic elements enable implementation of sizeable custom logic and complex RTL designs without external ASICs.
• Substantial on‑chip RAM: Approximately 34 Mbits of embedded memory reduces reliance on external memory for buffering and state retention.
• High I/O count: 534 user I/Os simplify integration with multiple external devices and parallel interfaces, reducing the need for external I/O expanders.
• Industrial operating range: Rated from −40 °C to 100 °C to support deployments in challenging environmental conditions.
• Compact BGA package: 1152‑BBGA (35×35) delivers a high pin count in a footprint suitable for modern compact boards and surface-mount assembly.
• Standards‑conscious manufacturing: RoHS compliance supports regulatory and environmental requirements for production.

Why Choose 5AGZME5H2F35I3LG?

The 5AGZME5H2F35I3LG Arria V GZ FPGA brings a combination of high logic density, significant embedded memory, and extensive I/O capability in an industrial-grade, surface-mount BGA package. It is positioned for designers who need scalable programmable logic capacity with robust environmental tolerance and high interconnect density.

This device is well suited to system designs that demand on‑chip resources to minimize external components, simplify BOM, and support long-term deployment in industrial environments. Its balance of logic, memory, and I/O makes it appropriate for teams implementing complex digital functions, multi-channel interfaces, and compact, high‑pin‑count assemblies.

Request a quote or submit an inquiry to get pricing, availability, and lead‑time information for 5AGZME5H2F35I3LG.