5AGZME5H3F35C4G

The 5AGZME5H3F35C4G is an Intel Arria V GZ field programmable gate array (FPGA) offered in a commercial grade. It integrates 400,000 logic elements, approximately 34.32 Mbits of embedded memory, and 534 user I/Os in a 1152‑BBGA (35×35) FCBGA surface‑mount package.

Designed for applications that require dense programmable logic and high I/O capacity, this device operates from a core supply range of 0.82 V to 0.88 V and is specified for operation from 0 °C to 85 °C. The device is RoHS compliant for standard environmental requirements.

Key Features

• Core Logic  Provides 400,000 logic elements for implementing complex programmable logic and custom hardware functions.
• Embedded Memory  Approximately 34.32 Mbits of on‑chip RAM to support buffering, data storage, and intermediate processing.
• I/O Density  534 user I/Os to support broad interfacing and high pin‑count designs.
• Package & Mounting  1152‑BBGA, FCBGA (supplier device package: 1152‑FBGA, 35×35) in a surface‑mount form factor for compact board integration.
• Power Supply  Core voltage supply specified from 0.82 V to 0.88 V to match system power design requirements.
• Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS‑compliant construction for use in standard, environmentally regulated production.
• Detailed Electrical & Configuration Specifications  Arria V family datasheet provides core performance, I/O timing, configuration timing, and initialization specifications relevant to system design and verification.

Typical Applications

• Custom programmable logic and prototyping  Implement complex, application‑specific logic using the device's large logic element count and on‑chip RAM.
• High‑density I/O subsystems  Support designs that require many external interfaces and signals with 534 user I/Os.
• Embedded processing and buffering  Leverage approximately 34.32 Mbits of embedded memory for data buffering, packet handling, or intermediate storage within custom datapaths.
• Compact board designs  The 1152‑BBGA FCBGA package supports high integration density in space‑constrained assemblies.

Unique Advantages

• High logic capacity: 400,000 logic elements enable substantial on‑chip programmability for complex designs without immediate reliance on external logic.
• Significant embedded memory: Approximately 34.32 Mbits of RAM reduces the need for external memory in many buffering and intermediate storage tasks.
• Extensive I/O resources: 534 user I/Os provide flexibility for interfacing to sensors, peripherals, and parallel buses.
• Compact, surface‑mount package: 1152‑BBGA (35×35) FCBGA supports dense PCB layouts while maintaining a high pin count.
• Defined power and thermal envelope: Specified core voltage range (0.82–0.88 V) and commercial operating temperature (0–85 °C) allow predictable system power and thermal planning.
• RoHS compliant: Meets common environmental and manufacturing requirements for lead‑free assembly.

Why Choose 5AGZME5H3F35C4G?

The 5AGZME5H3F35C4G delivers a combination of large programmable logic capacity, substantial on‑chip memory, and a high I/O count in a compact FCBGA package. These characteristics make it suitable for designers who need to implement complex, high‑pin‑count logic while managing board space and system integration.

With clearly specified electrical and configuration parameters, this commercial‑grade Arria V GZ device supports predictable system design and verification efforts. It is well suited to teams building advanced FPGA‑based prototypes, I/O‑dense subsystems, and embedded processing functions where integration and defined operating specifications are essential.

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