5AGZME5H2F35C3G

The 5AGZME5H2F35C3G is an Intel Arria V GZ family FPGA supplied in a 1152-BBGA (35×35) FCBGA package for surface-mount PCB integration. This commercial-grade device combines high logic density, substantial on-chip memory, and a large I/O count to support complex programmable logic and interface requirements.

Designed for systems that require programmable hardware flexibility with detailed electrical and configuration documentation, the device is suited to designs that must balance integration density and documented operating constraints such as voltage and temperature.

Key Features

• Core Logic  400,000 logic elements to implement complex custom logic and large-scale programmable designs.
• Embedded Memory  Approximately 34.3 Mbits of on-chip RAM bits (34.322432 Mbits) for buffering, state storage, and local data processing.
• I/O Capacity  534 general-purpose I/O pins to support broad interfacing and high-channel-count designs.
• Power and Voltage  Core voltage supply specified from 820 mV to 880 mV; consult device documentation for full power and sequencing requirements.
• Package & Mounting  1152-BBGA (35×35) FCBGA supplier device package intended for surface-mount assembly.
• Operating Range & Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Configuration & Timing Documentation  Datasheet content includes electrical characteristics, switching characteristics, I/O timing and detailed configuration timing sections (JTAG, Fast Passive Parallel, Active Serial, Passive Serial, and related configuration specifications).
• Standards Compliance  RoHS-compliant for lead-free manufacturing and environmental compliance.

Typical Applications

• High-density programmable logic systems  Implement complex logic functions using the device’s 400,000 logic elements and on-chip RAM.
• High-channel I/O hubs  Leverage 534 I/O pins for systems requiring broad peripheral or parallel interface support.
• Embedded acceleration and data buffering  Use the approximately 34.3 Mbits of embedded memory to support local data buffering and custom acceleration functions.
• Board-level integration for commercial equipment  Surface-mount 1152-BBGA package enables dense PCB layouts in commercial electronic systems within the specified 0 °C to 85 °C range.

Unique Advantages

• High logic capacity: 400,000 logic elements provide substantial programmable resources for large designs without external logic expansion.
• Significant on-chip memory: Approximately 34.3 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage tasks.
• Extensive I/O count: 534 I/O pins simplify routing of multiple peripherals and interfaces while keeping designs compact.
• Commercial operating specification: 0 °C to 85 °C operating range and documented electrical characteristics support reliable deployment in commercial environments.
• Surface-mount BBGA packaging: 1152-BBGA (35×35) FCBGA format supports high-density PCB assembly and consistent board-level integration.
• Comprehensive documentation: Detailed datasheet coverage of electrical, switching, and configuration timing helps accelerate product development and validation.

Why Choose 5AGZME5H2F35C3G?

This Arria V GZ FPGA is positioned for commercial designs that require a combination of high logic density, substantial embedded memory, and a large number of I/O pins in a surface-mount BBGA package. Its documented electrical characteristics and configuration timing information support engineering verification and predictable system integration.

The device is suitable for engineering teams that need programmable hardware capacity with clear specifications for core voltage (820 mV–880 mV), operating temperature (0 °C–85 °C), and package integration. RoHS compliance and comprehensive datasheet guidance add value for procurement and design planning.

Request a quote or submit a purchase inquiry to begin procurement of the 5AGZME5H2F35C3G Arria V GZ FPGA.