5AGZME5K2F40I3LN

The 5AGZME5K2F40I3LN is an Arria V GZ field-programmable gate array (FPGA) IC from Intel. It provides a high-density programmable fabric with 400,000 logic elements, approximately 34.3 Mbits of embedded memory, and up to 674 general-purpose I/O pins for complex system integration.

Designed and specified for industrial operation, this device supports a core voltage supply range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C, packaged in a 1517-ball FCBGA (1517-FBGA, 40×40) surface-mount package.

Key Features

• High Logic Capacity — 400,000 logic elements to implement large, parallelizable designs and complex state machines.
• Embedded Memory — Approximately 34.3 Mbits of on-chip RAM for buffering, packet storage, and algorithmic working memory.
• Extensive I/O — 674 I/O pins to support wide external interfacing, multi-channel sensor arrays, and high pin-count-peripheral connectivity.
• Industrial Temperature Grade — Rated for −40 °C to 100 °C operation, suitable for industrial environments and temperature-stressed deployments.
• Power Supply Range — Core supply specified from 820 mV to 880 mV for predictable core power planning.
• Package & Mounting — 1517-ball FCBGA (1517-FBGA, 40×40) surface-mount package for a compact, high-density board footprint.
• Standards Compliance — RoHS-compliant construction for environmental and regulatory alignment.
• Comprehensive Documentation — Part of the Arria V GZ device family with detailed electrical, switching, and configuration specifications available in the Arria V GZ device datasheet.

Typical Applications

• Industrial Control & Automation — Industrial temperature rating and high logic density make this FPGA suitable for motor control, process automation logic, and real-time control systems.
• High-Density Signal Processing — Large logic capacity and substantial on-chip RAM support DSP functions, filtering, and data aggregation tasks.
• Protocol Bridging and System Integration — Extensive I/O enables protocol translation, multi-interface bridging, and integration of numerous peripherals in a single device.

Unique Advantages

• Significant Programmable Fabric: 400,000 logic elements enable consolidation of complex functions that reduce overall BOM and board area.
• Large On-Chip Memory: Approximately 34.3 Mbits of embedded RAM reduce external memory dependency for latency-sensitive tasks.
• High I/O Density: 674 I/Os provide the flexibility to connect to many sensors, controllers, and external devices without additional multiplexing logic.
• Industrial-Ready Thermal Range: −40 °C to 100 °C operation supports deployment in demanding environmental conditions.
• Compact High-Density Package: 1517-ball FCBGA (40×40) offers a balanced footprint for space-constrained, high-performance boards.
• Regulatory Compliance: RoHS compliance simplifies environmental qualification and regulatory acceptance.

Why Choose 5AGZME5K2F40I3LN?

The 5AGZME5K2F40I3LN positions itself as a high-capacity, industrial-grade FPGA suitable for designers who need substantial logic density, abundant on-chip memory, and a wide I/O count in a compact BGA package. Its operating voltage range and documented Arria V GZ specifications support predictable power and configuration planning for complex designs.

This Intel Arria V GZ device is appropriate for teams building scalable, high-performance embedded systems and industrial applications that demand reliable operation across a broad temperature range and clear, device-level documentation for electrical and configuration details.

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