5AGZME5K3F40I4N

The 5AGZME5K3F40I4N is an Intel Arria V GZ Field Programmable Gate Array (FPGA) offered in a 1517-BBGA FCBGA package. It delivers a high-density programmable fabric with 400,000 logic elements and substantial embedded memory for complex digital designs.

Designed for industrial-grade applications, this device provides a large I/O count and a defined supply/thermal envelope suitable for systems requiring high integration, abundant on-chip RAM, and robust I/O connectivity.

Key Features

• Core Capacity — 400,000 logic elements to implement large-scale digital logic and custom hardware accelerators.
• Embedded Memory — Approximately 34.3 Mbits of on-chip RAM (34,322,432 bits) for buffering, LUT-based storage, and memory-intensive functions.
• I/O Resources — 674 user I/O pins to support wide parallel interfaces, multiple peripherals, and high-connectivity system designs.
• Power Supply — Voltage supply range of 820 mV to 880 mV, enabling defined core power planning for system power budgeting.
• Package & Mounting — 1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), with surface-mount mounting type for compact PCB integration.
• Industrial Grade & Temperature — Industrial grade device rated for operation from −40 °C to 100 °C for deployment in demanding environments.
• Compliance — RoHS compliant to support regulatory requirements for lead-free assemblies.

Typical Applications

• High-density signal processing — Use the large logic capacity and embedded RAM to implement complex digital signal processing pipelines and custom accelerators.
• Industrial control systems — The industrial temperature rating and extensive I/O make this FPGA suitable for control, monitoring, and automation interfaces.
• High-throughput data interfaces — Wide I/O count and on-chip memory enable implementation of wide buses, buffering, and protocol bridging in data-centric systems.
• Prototype and system integration — High logic density and large memory resources allow system designers to consolidate functions and validate complex hardware architectures.

Unique Advantages

• High logic density: 400,000 logic elements support larger, more complex designs without immediate need for external logic expansion.
• Substantial embedded memory: Approximately 34.3 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O count: 674 I/O pins provide the flexibility to connect multiple peripherals, wide buses, and high-pin-count interfaces directly to the FPGA.
• Industrial temperature range: Rated from −40 °C to 100 °C to meet the thermal requirements of many industrial deployments.
• Compact FCBGA packaging: 1517-BBGA (40×40) FCBGA package balances high integration density with surface-mount PCB assembly.
• Regulatory compliance: RoHS compliant for lead-free manufacturing and global regulatory alignment.

Why Choose 5AGZME5K3F40I4N?

The 5AGZME5K3F40I4N positions itself as a high-capacity Arria V GZ FPGA suited for designs that require a combination of significant logic resources, large on-chip memory, and broad I/O connectivity within an industrial temperature envelope. Its specified voltage range and package options support integration into compact, power-aware designs where on-board programmable logic consolidation is desired.

This device is appropriate for engineering teams building memory- and I/O-intensive systems that require industrial-grade operation and RoHS compliance. It is supplied by Intel as part of the Arria V GZ device family, with supporting documentation available in the device datasheet for detailed electrical and timing specifications.

If you would like pricing, availability, or to request a quote for the 5AGZME5K3F40I4N Arria V GZ FPGA, submit a purchase inquiry or request a quote through your preferred procurement channel.