5AGZME7H2F35I3LN

The 5AGZME7H2F35I3LN is an Intel Arria V GZ field programmable gate array (FPGA) supplied in a 1152-BBGA FCBGA package. It provides a high-density programmable fabric with a large on-chip memory array and extensive I/O count for complex, configurable digital designs.

Designed and specified for industrial-grade applications, this device combines substantial logic capacity, approximately 40.25 Mbits of embedded memory, and a wide operating temperature range to support demanding system requirements.

Key Features

• Core Logic  Provides 450,000 logic elements for large-scale programmable logic implementation and custom hardware acceleration.
• Embedded Memory  Approximately 40.25 Mbits of on-chip RAM (40,249,344 bits) to support buffering, state machines, and data storage within the FPGA fabric.
• I/O Density  Up to 534 user I/O pins to support broad interfacing and parallel connectivity to external devices and subsystems.
• Power and Voltage  Core voltage supply range specified from 820 mV to 880 mV for the device core domains.
• Package & Mounting  1152-BBGA (FCBGA) / supplier package 1152-FBGA (35×35) in a surface-mount form factor suitable for high-density board designs.
• Industrial Grade & Temperature Range  Industrial-grade device rated for operation from −40 °C to 100 °C, supporting deployments in thermally demanding environments.
• Standards Compliance  RoHS compliant.
• Documentation  Device-level datasheet coverage includes electrical characteristics, switching characteristics, configuration specifications, and I/O timing for the Arria V GZ family.

Typical Applications

• High-density logic systems  For designs requiring up to 450,000 logic elements and substantial on-chip RAM for complex control, processing, or acceleration tasks.
• I/O-rich designs  Systems that require large numbers of external connections—up to 534 I/Os—for parallel interfaces, sensor arrays, or multi-channel subsystems.
• Industrial embedded systems  Applications that benefit from industrial-grade temperature operation (−40 °C to 100 °C) and surface-mount packaging for compact board implementations.

Unique Advantages

• High logic capacity: 450,000 logic elements enable integration of complex logic, control paths, and custom datapaths within a single device.
• Significant on-chip RAM: Approximately 40.25 Mbits of embedded memory reduces external memory dependence and simplifies board-level design.
• Extensive I/O support: 534 I/Os provide flexibility for diverse interfacing needs without additional I/O expanders.
• Industrial temperature rating: Rated operation from −40 °C to 100 °C for use in environments with broader thermal demands.
• Compact, surface-mount package: 1152-BBGA (35×35) FCBGA footprint supports dense PCB layouts while maintaining high pin count.
• Regulatory alignment: RoHS compliance supports environmentally-conscious manufacturing requirements.

Why Choose 5AGZME7H2F35I3LN?

The 5AGZME7H2F35I3LN Arria V GZ FPGA delivers a balanced combination of large programmable logic capacity, ample embedded memory, and a high I/O count in a compact surface-mount FCBGA package. Its industrial-grade temperature rating and documented electrical and configuration specifications make it suitable for complex, long-life designs that require reliable, on-board programmability.

This device is appropriate for design teams and procurement organizations that need substantial on-chip resources, deterministic configuration options, and a documented datasheet covering electrical, switching, and configuration details for the Arria V GZ family.

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