5CEBA4F17C7N

IC FPGA 128 I/O 256FBGA
Part Description

Cyclone® V E Field Programmable Gate Array (FPGA) IC 128 3464192 49000 256-LBGA

Quantity 39 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O128Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18480Number of Logic Elements/Cells49000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3464192

Overview of 5CEBA4F17C7N – Cyclone® V E Field Programmable Gate Array (FPGA) IC 128 3464192 49000 256-LBGA

The 5CEBA4F17C7N is a Cyclone V E series FPGA providing a balance of programmable logic capacity, on-chip memory, and flexible I/O in a compact 256-ball BGA package. It targets high-volume, cost-sensitive applications across industrial, wireless and wireline, and related markets where integration and power efficiency matter.

Key device parameters include 49,000 logic elements, approximately 3.46 Mbits of embedded memory, 128 general-purpose I/O, surface-mount 256-LBGA package, and a specified core supply range of 1.07 V to 1.13 V with commercial operating temperature from 0 °C to 85 °C.

Key Features

  • Logic Capacity  49,000 logic elements providing significant gate count for medium-density FPGA designs.
  • Embedded Memory  Approximately 3.46 Mbits of on-chip RAM to support buffering, FIFOs, and local storage.
  • I/O Count  128 general-purpose I/O pins for flexible peripheral and board-level interfacing.
  • Package & Mounting  256-LBGA (supplier package: 256-FBGA 17×17) in a surface-mount form factor for compact PCB layouts.
  • Power and Voltage  Core supply specified at 1.07 V to 1.13 V (nominally 1.1 V) to align with low-voltage system designs.
  • Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Standards & Compliance  RoHS-compliant material and manufacturing status.
  • Cyclone V Family Architecture  Built on a 28 nm low-power process with enhanced fabric features including 8-input adaptive logic modules, M10K internal memory blocks (with ECC support), and variable-precision DSP resources as documented for the Cyclone V device family.

Typical Applications

  • Industrial Control  Programmable logic and embedded memory support sensor aggregation, motion control logic, and deterministic I/O handling in automated systems.
  • Wireless & Wireline Communications  Logic capacity and on-chip memory enable protocol processing, packet buffering, and interface bridging in baseband or access equipment.
  • High-Volume Embedded Systems  Compact 256-LBGA packaging and a low-voltage core make the device suitable for space-constrained, cost-sensitive consumer and commercial electronics.

Unique Advantages

  • Substantial Logic Density: 49,000 logic elements provide headroom for mid-range FPGA designs without excessive board-level complexity.
  • Integrated On-Chip Memory: Approximately 3.46 Mbits of embedded RAM reduces external memory dependence and simplifies board routing.
  • Low-Voltage Core Operation: Specified 1.07–1.13 V core supply supports energy-efficient designs and aligns with modern low-voltage power domains.
  • Family-Level Fabric Enhancements: Cyclone V architecture features such as 8-input adaptive logic modules, M10K blocks with ECC, and variable-precision DSP blocks offer flexible implementation options for compute and signal-processing tasks.
  • Compact, Surface-Mount Packaging: 256-LBGA (17×17 FBGA footprint) enables dense board integration for space-constrained applications.
  • Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and global deployment.

Why Choose 5CEBA4F17C7N?

The 5CEBA4F17C7N brings Cyclone V E family architecture and proven low-power 28 nm process characteristics together in a commercially graded FPGA with 49,000 logic elements, ample embedded memory, and 128 I/O. Its combination of fabric features, on-chip memory, and compact 256-LBGA footprint makes it a practical choice for designers targeting cost-sensitive, high-volume products that require moderate logic density and flexible I/O.

For teams building communications equipment, industrial controllers, or embedded systems where board space and power budgets are constrained, this device offers a clear balance of integration, performance, and manufacturability backed by documented Cyclone V device capabilities.

If you would like pricing, availability, or a formal quote for 5CEBA4F17C7N, submit a request and our team will respond with the necessary procurement information and lead-time details.

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