5CEBA4F17I7

IC FPGA 128 I/O 256FBGA
Part Description

Cyclone® V E Field Programmable Gate Array (FPGA) IC 128 3464192 49000 256-LBGA

Quantity 121 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O128Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18480Number of Logic Elements/Cells49000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3464192

Overview of 5CEBA4F17I7 – Cyclone® V E Field Programmable Gate Array (FPGA) IC 128 3464192 49000 256-LBGA

The 5CEBA4F17I7 is an Intel Cyclone V E series FPGA delivered in a 256-LBGA package (supplier package: 256-FBGA, 17×17). It integrates programmable logic, embedded memory, and I/O to address industrial, wireless and wireline, and military application spaces that require a balance of integration, low power, and system-level interfaces.

This device provides roughly 49,000 logic elements, approximately 3.46 Mbits of embedded memory, and 128 I/O pins in a surface-mount LBGA footprint. Core supply operation is specified between 1.07 V and 1.13 V, with an operating temperature range of −40 °C to 100 °C and RoHS compliance.

Key Features

  • Logic Capacity — Approximately 49,000 logic elements for mid-range FPGA designs and on-chip custom logic implementation.
  • Embedded Memory — Approximately 3.46 Mbits of on-chip RAM to support buffering, frame storage, and local data structures for signal processing and control functions.
  • I/O Count — 128 user I/O pins in a 256-LBGA package, enabling connectivity to peripherals, sensors, and external memory interfaces.
  • Process and Core Supply — Built on a 28 nm low-power process with a core voltage region around 1.1 V (specified 1.07 V to 1.13 V) for reduced power consumption.
  • Integrated Architecture (series-level) — Cyclone V devices include features such as integrated transceivers and hard memory controllers, plus variable-precision DSP blocks and M10K memory blocks (series features described in the Cyclone V documentation).
  • Package and Mounting — 256-LBGA surface-mount package (supplier package 256-FBGA, 17×17) for compact board-level integration.
  • Industrial Temperature Grade — Specified for operation from −40 °C to 100 °C, suitable for industrial-class deployments.
  • Standards and Compliance — RoHS-compliant material status to meet common environmental requirements.

Typical Applications

  • Industrial Control — Deterministic logic and embedded memory support motor control, PLC interfacing, and real-time machine control functions within industrial temperature ranges.
  • Wireless and Wireline Communications — On-chip DSP resources, embedded memory, and series-level transceiver and hard memory-controller features make the device suitable for protocol processing, packet handling, and fronthaul/backhaul tasks.
  • Defense and Aerospace Electronics — Mid-density programmable logic and rugged operating temperature capability for specialized signal processing and I/O aggregation in military applications.
  • Embedded SoC and Processing — Use in designs that combine custom logic, memory buffering, and peripheral interfacing where a compact LBGA package and industrial-grade operation are required.

Unique Advantages

  • Balanced Logic and Memory — Approximately 49,000 logic elements paired with ~3.46 Mbits of embedded memory to implement moderate-complexity logic alongside local data storage.
  • Optimized Power Envelope — 28 nm low-power process characteristics and a narrow core supply range (1.07–1.13 V) support power-efficient designs.
  • Industrial Temperature Range — Rated for −40 °C to 100 °C operation, enabling deployment in harsh or temperature-variable environments.
  • Compact, Surface-Mount LBGA Package — 256-LBGA (256-FBGA supplier package, 17×17) enables high-density board layouts while providing 128 I/O pins for system connectivity.
  • RoHS Compliance — Meets common environmental material requirements for regulated markets.

Why Choose 5CEBA4F17I7?

The 5CEBA4F17I7 Cyclone V E FPGA delivers a practical combination of mid-range logic density, embedded memory, and I/O in a compact LBGA form factor targeted at industrial, communications, and defense designs. Its 28 nm low-power process and tight core-voltage specification support energy-conscious implementations while the industrial temperature grade and RoHS compliance address deployment and regulatory considerations.

This device is suited to engineers who need scalable programmable logic with on-chip memory and I/O for system-level integration, buffering, and protocol handling, backed by the Cyclone V family documentation and design flow.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the 5CEBA4F17I7 Cyclone V E FPGA.

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