5CEBA4F17I7
| Part Description |
Cyclone® V E Field Programmable Gate Array (FPGA) IC 128 3464192 49000 256-LBGA |
|---|---|
| Quantity | 121 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 128 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18480 | Number of Logic Elements/Cells | 49000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3464192 |
Overview of 5CEBA4F17I7 – Cyclone® V E Field Programmable Gate Array (FPGA) IC 128 3464192 49000 256-LBGA
The 5CEBA4F17I7 is an Intel Cyclone V E series FPGA delivered in a 256-LBGA package (supplier package: 256-FBGA, 17×17). It integrates programmable logic, embedded memory, and I/O to address industrial, wireless and wireline, and military application spaces that require a balance of integration, low power, and system-level interfaces.
This device provides roughly 49,000 logic elements, approximately 3.46 Mbits of embedded memory, and 128 I/O pins in a surface-mount LBGA footprint. Core supply operation is specified between 1.07 V and 1.13 V, with an operating temperature range of −40 °C to 100 °C and RoHS compliance.
Key Features
- Logic Capacity — Approximately 49,000 logic elements for mid-range FPGA designs and on-chip custom logic implementation.
- Embedded Memory — Approximately 3.46 Mbits of on-chip RAM to support buffering, frame storage, and local data structures for signal processing and control functions.
- I/O Count — 128 user I/O pins in a 256-LBGA package, enabling connectivity to peripherals, sensors, and external memory interfaces.
- Process and Core Supply — Built on a 28 nm low-power process with a core voltage region around 1.1 V (specified 1.07 V to 1.13 V) for reduced power consumption.
- Integrated Architecture (series-level) — Cyclone V devices include features such as integrated transceivers and hard memory controllers, plus variable-precision DSP blocks and M10K memory blocks (series features described in the Cyclone V documentation).
- Package and Mounting — 256-LBGA surface-mount package (supplier package 256-FBGA, 17×17) for compact board-level integration.
- Industrial Temperature Grade — Specified for operation from −40 °C to 100 °C, suitable for industrial-class deployments.
- Standards and Compliance — RoHS-compliant material status to meet common environmental requirements.
Typical Applications
- Industrial Control — Deterministic logic and embedded memory support motor control, PLC interfacing, and real-time machine control functions within industrial temperature ranges.
- Wireless and Wireline Communications — On-chip DSP resources, embedded memory, and series-level transceiver and hard memory-controller features make the device suitable for protocol processing, packet handling, and fronthaul/backhaul tasks.
- Defense and Aerospace Electronics — Mid-density programmable logic and rugged operating temperature capability for specialized signal processing and I/O aggregation in military applications.
- Embedded SoC and Processing — Use in designs that combine custom logic, memory buffering, and peripheral interfacing where a compact LBGA package and industrial-grade operation are required.
Unique Advantages
- Balanced Logic and Memory — Approximately 49,000 logic elements paired with ~3.46 Mbits of embedded memory to implement moderate-complexity logic alongside local data storage.
- Optimized Power Envelope — 28 nm low-power process characteristics and a narrow core supply range (1.07–1.13 V) support power-efficient designs.
- Industrial Temperature Range — Rated for −40 °C to 100 °C operation, enabling deployment in harsh or temperature-variable environments.
- Compact, Surface-Mount LBGA Package — 256-LBGA (256-FBGA supplier package, 17×17) enables high-density board layouts while providing 128 I/O pins for system connectivity.
- RoHS Compliance — Meets common environmental material requirements for regulated markets.
Why Choose 5CEBA4F17I7?
The 5CEBA4F17I7 Cyclone V E FPGA delivers a practical combination of mid-range logic density, embedded memory, and I/O in a compact LBGA form factor targeted at industrial, communications, and defense designs. Its 28 nm low-power process and tight core-voltage specification support energy-conscious implementations while the industrial temperature grade and RoHS compliance address deployment and regulatory considerations.
This device is suited to engineers who need scalable programmable logic with on-chip memory and I/O for system-level integration, buffering, and protocol handling, backed by the Cyclone V family documentation and design flow.
Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the 5CEBA4F17I7 Cyclone V E FPGA.

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