5CEBA4F23C7N

The 5CEBA4F23C7N is an Intel Cyclone V E field-programmable gate array delivering 49,000 logic elements and approximately 3.46 Mbits of embedded memory (3,464,192 bits). It is built on a low-power 28 nm process and targets bandwidth-sensitive, cost-conscious designs that require significant on-chip memory and flexible I/O.

Packaged in a 484‑FBGA (23×23) surface-mount package with 224 I/Os, this commercial-grade device operates from a 1.07 V to 1.13 V supply and across a 0 °C to 85 °C operating range, making it suitable for a wide range of embedded and communications applications.

Key Features

• Process and core — Built on TSMC 28‑nm low‑power (28LP) process technology; Cyclone V family documentation references a 1.1 V core and low-power optimizations.
• Logic capacity — 49,000 logic elements to implement moderate-complexity digital designs and custom logic.
• Embedded memory — Approximately 3.46 Mbits of on‑chip RAM (3,464,192 bits) to support frame buffers, FIFOs, and local data storage.
• I/O and package — 224 general-purpose I/O pins in a 484‑FBGA (23×23) surface‑mount package (package case: 484‑BGA) for dense connectivity.
• Power and thermal — Core supply range 1.07 V to 1.13 V and commercial operating temperature range 0 °C to 85 °C.
• System-level IP (series) — Cyclone V devices include integrated features across the family such as hard memory controllers, integrated transceivers, and an available hard processor system (HPS) with Arm Cortex‑A9 in applicable variants (as documented for the Cyclone V family).
• Environmental compliance — RoHS‑compliant.

Typical Applications

• Wireless and wireline communications — Leverage on‑chip memory and the Cyclone V family’s integrated transceiver and memory IP to implement protocol processing, framing, and interface bridging.
• Embedded SoC and edge compute — Use the device’s logic and memory capacity in designs that combine programmable logic with processor subsystems in Cyclone V family variants.
• High‑density I/O interfaces — Ideal for designs that require numerous GPIOs and compact BGA packaging for board‑level I/O aggregation or protocol conversion.
• Prototyping and system integration — Mid-density programmable fabric and substantial on‑chip RAM support hardware validation and system prototyping.

Unique Advantages

• Balanced logic and memory — 49,000 logic elements combined with approximately 3.46 Mbits of embedded RAM provide a balanced resource mix for data buffering and control logic.
• High I/O density in a compact package — 224 I/Os in a 484‑FBGA (23×23) footprint enable dense board routing without a large package footprint.
• Low‑power architecture — Based on a 28 nm low‑power process with a nominal core supply around 1.1 V, suitable for designs where power budget matters.
• Commercial temperature rating — Operates across 0 °C to 85 °C for standard commercial deployments.
• RoHS compliance — Meets common environmental regulations for lead‑free assembly.

Why Choose 5CEBA4F23C7N?

The 5CEBA4F23C7N occupies a mid‑density point in the Cyclone V E family, delivering a practical combination of programmable logic, sizeable embedded RAM, and high I/O density in a compact 484‑FBGA package. It is a pragmatic choice for engineers building bandwidth‑sensitive communications endpoints, embedded compute modules, and systems that require substantial local memory without moving to higher‑cost, higher‑power device tiers.

Designed within the Cyclone V family framework, this device benefits from documented family features such as low‑power process technology and integrated system IP across applicable variants, supporting scalable designs and straightforward migration within the Cyclone V portfolio.

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