5CEFA4U19I7N

The 5CEFA4U19I7N is an Intel Cyclone® V E family FPGA packaged in a 484-FBGA (484-UBGA, 19×19) surface-mount package. It delivers a balanced combination of programmable logic resources, embedded memory, and I/O density for cost-sensitive, high-volume designs.

Designed for industrial, wireless/wireline, and military applications, this device emphasizes low-power operation, integration of hard IP blocks and transceivers, and a compact footprint to help reduce system complexity and BOM count.

Key Features

• Logic Capacity Approximately 49,000 logic elements to implement combinational and sequential logic for mid-density FPGA designs.
• Embedded Memory Approximately 3.46 Mbits of on-chip RAM (3,464,192 bits) for data buffering, state storage, and local memory needs.
• I/O Count 224 user I/O pins to interface with peripherals, memory, and external logic.
• Package & Mounting 484-FBGA (supplier device package: 484-UBGA, 19×19) in a surface-mount configuration for compact board-level integration.
• Power Core supply range of 1.07 V to 1.13 V consistent with low-power 28 nm-class process operation.
• Operating Temperature Industrial temperature grade with a −40 °C to 100 °C operating range for deployment in demanding environments.
• Standards & Compliance RoHS-compliant to support regulatory and manufacturing requirements.
• Family Capabilities (from Cyclone V overview) Built on a 28 nm low-power process with integrated transceivers and hard memory controllers to support higher bandwidth and tighter system integration.

Typical Applications

• Industrial Systems — Suited to industrial applications that need an industrial temperature range (−40 °C to 100 °C), low power operation, and compact packaging.
• Wireless & Wireline Infrastructure — The Cyclone V family integration of transceivers and hard memory controllers supports designs that require controlled bandwidth and I/O density.
• Military and Ruggedized Electronics — Industrial-grade temperature range and a high pin count make this FPGA appropriate for defense-related systems where environmental range and reliable I/O are required.

Unique Advantages

• Integrated System-Level Features — Family-level integration of transceivers and hard memory controllers reduces external IP requirements and simplifies board design.
• Low-Power 28 nm Process — Built on a TSMC 28 nm low-power process (Cyclone V family), enabling lower core supply voltages (1.07–1.13 V) for energy-sensitive designs.
• Balanced Resource Set — Approximately 49,000 logic elements, ~3.46 Mbits of embedded memory, and 224 I/Os provide a balanced mix of logic, memory, and connectivity in a single device.
• Industrial Temperature Range — Rated for −40 °C to 100 °C to meet deployment requirements across a wide range of environmental conditions.
• Compact, Surface-Mount Package — 484-FBGA (484-UBGA, 19×19) enables high-density board layouts while maintaining a robust mounting style for production assembly.

Why Choose 5CEFA4U19I7N?

The 5CEFA4U19I7N delivers a practical combination of logic density, embedded memory, and I/O count in an industrial-grade Cyclone V E package. Its low-voltage core operation and family-level integration features make it a solid choice for designers seeking reduced BOM complexity and a compact FPGA solution for mid-density applications.

Built on the Cyclone V device architecture and backed by Intel's device portfolio documentation, this part is suitable for teams that require a verified FPGA platform with clear resource definitions and industrial thermal capability.

If you would like pricing, availability, or a formal quote for 5CEFA4U19I7N, submit a request and our team will respond with the next steps for procurement and technical support.