5CEFA5F23I7N

IC FPGA 240 I/O 484FBGA
Part Description

Cyclone® V E Field Programmable Gate Array (FPGA) IC 240 5001216 77000 484-BGA

Quantity 31 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O240Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs29080Number of Logic Elements/Cells77000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5001216

Overview of 5CEFA5F23I7N – Cyclone® V E Field Programmable Gate Array, 77,000 Logic Elements, 484-BGA

The 5CEFA5F23I7N is a Cyclone® V E field programmable gate array (FPGA) offered in a 484-ball BGA (23 × 23) package for surface-mount applications. It provides approximately 77,000 logic elements and roughly 5 Mbits of embedded RAM, packaged with 240 general-purpose I/Os.

As a member of the Cyclone V family, this device targets industrial and high-bandwidth, cost-sensitive applications by combining mid-range logic capacity, compact packaging, and a low-voltage core supply. Family-level characteristics include low-power 28 nm process technology and features such as integrated transceivers and hard memory controllers.

Key Features

  • Logic Capacity  Approximately 77,000 logic elements for mid-density FPGA designs.
  • Embedded Memory  Total on-chip RAM of 5,001,216 bits (approximately 5 Mbits) to support buffering, lookup tables, and embedded data structures.
  • I/O and Package  240 I/Os in a 484-FBGA (23×23) package; surface-mount mounting type for compact board integration.
  • Power and Core Voltage  Operates with a core supply range of 1.07 V to 1.13 V (centered on 1.1 V), consistent with low-voltage 28 nm family designs.
  • Operating Temperature  Industrial-grade temperature range from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Family-level Technology  Built on the Cyclone V platform using TSMC 28-nm low-power process technology; family includes enhancements such as integrated transceivers and hard memory controllers.
  • Standards Compliance  RoHS‑compliant device suitable for regulated supply chains.

Typical Applications

  • Industrial Control  Used for control logic, protocol bridging, and I/O aggregation where industrial temperature range and mid-level logic density are required.
  • Wireless and Wireline Communications  Applicable to data-path and protocol processing where Cyclone V family transceiver and memory features support bandwidth and buffering needs.
  • Military and Defense  Suitable for systems requiring industrial-grade thermal performance and field-programmable logic for adaptable processing and interface tasks.

Unique Advantages

  • Mid-range logic density: 77,000 logic elements enable substantial logic integration without the overhead of higher-density families.
  • On-chip RAM: Approximately 5 Mbits of embedded memory reduces reliance on external memory for many buffering and state-storage needs.
  • High I/O count in compact footprint: 240 I/Os in a 484-FBGA (23×23) package supports feature-rich designs in a space-efficient package.
  • Industrial temperature support: −40 °C to 100 °C rating provides margin for deployment in demanding environments.
  • Low-voltage core operation: Narrow 1.07–1.13 V core supply window aligns with low-power process advantages for power-conscious designs.
  • Regulatory readiness: RoHS compliance simplifies environmental and supply-chain compliance efforts.

Why Choose 5CEFA5F23I7N?

The 5CEFA5F23I7N positions itself as a practical, industrial-grade Cyclone V E FPGA for engineers who need substantial logic capacity, on-chip memory, and a high I/O count in a compact BGA package. Its operating voltage and family-level low-power process characteristics make it appropriate for designs that balance performance with power efficiency.

Choose this device when your design requires ruggedized temperature range, roughly 77,000 logic elements, and the flexibility of an FPGA platform backed by the Cyclone V family feature set. Its combination of embedded RAM, I/O density, and package options supports scalable development and integration into mid-density embedded systems and communication equipment.

Request a quote or submit a quote to check availability and pricing for 5CEFA5F23I7N and to discuss delivery and lead-time options.

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