5CEFA5M13I7N

IC FPGA 175 I/O 383MBGA
Part Description

Cyclone® V E Field Programmable Gate Array (FPGA) IC 175 5001216 77000 383-TFBGA

Quantity 1,964 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package383-MBGA (13x13)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case383-TFBGANumber of I/O175Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs29080Number of Logic Elements/Cells77000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5001216

Overview of 5CEFA5M13I7N – Cyclone® V E FPGA, 77k Logic Elements, 383-TFBGA

The 5CEFA5M13I7N is a Cyclone® V E field-programmable gate array (FPGA) IC optimized for low-power, cost-sensitive embedded systems. It implements a mid-density Cyclone V architecture that combines programmable logic, on-chip memory, and a broad set of I/O in a compact surface-mount package.

Designed for industrial and communications applications, this device delivers a balanced mix of logic capacity, embedded memory, and I/O count while operating over an industrial temperature range, enabling reliable deployment in harsh environments.

Key Features

  • Logic Capacity — 77,000 logic elements provide substantial programmable fabric for moderate to complex logic and control functions.
  • Embedded Memory — Total on-chip RAM: 5,001,216 bits (approximately 5.00 Mbits) for buffering, state storage, and on-chip data processing.
  • I/O and Packaging — 175 general-purpose I/O pins in a 383-TFBGA package; supplier device package listed as 383-MBGA (13×13) and surface-mount mounting for compact board integration.
  • Voltage and Power — Core voltage operating range of 1.07 V to 1.13 V to match low-voltage system domains.
  • Industrial Temperature Grade — Rated for operation from −40°C to 100°C for deployment in industrial environments.
  • Family-Level Architecture — Cyclone V family features referenced in the device datasheet include a low-power 28 nm process, enhanced 8-input adaptive logic modules, variable-precision DSP blocks, embedded M10K memory blocks with ECC options, and integrated hard IP such as memory controllers and transceivers.
  • Standards and Compliance — RoHS compliant for global electronics manufacturing requirements.

Typical Applications

  • Industrial Control — Real-time control, automation logic and sensor interfacing where industrial temperature operation and compact packaging are required.
  • Wireless and Wireline Infrastructure — Protocol bridging, packet buffering and mid-rate signal processing enabled by on-chip memory and DSP resources.
  • Military and Ruggedized Systems — Signal processing and I/O aggregation in systems that demand operation across a wide temperature range.
  • Embedded SoC Prototyping — Mid-density FPGA fabric suitable for integrating custom logic alongside standard interface IP for proof-of-concept and production designs.

Unique Advantages

  • Balanced Integration: Combines 77,000 logic elements, substantial on-chip RAM and 175 I/Os in a compact BGA package to reduce board-level complexity.
  • Low-Voltage Operation: Narrow core voltage range (1.07 V–1.13 V) simplifies power-domain design for modern low-voltage systems.
  • Industrial Reliability: −40°C to 100°C operating range and surface-mount BGA packaging support deployment in industrial environments.
  • Family-Level Capabilities: Leverages Cyclone V architectural features such as 8-input ALMs, variable-precision DSP blocks, embedded M10K memory blocks, and integrated hard IP for memory and high-speed interfaces.
  • Compliance-Ready: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5CEFA5M13I7N?

The 5CEFA5M13I7N places a well-rounded Cyclone V E FPGA into your design with 77k logic elements, approximately 5.00 Mbits of on-chip RAM, and 175 I/Os while supporting industrial temperature operation. It is suited for engineers who need a mid-density, low-power FPGA with family-level features such as DSP blocks, embedded memory, and integrated interface IP that simplify system architecture and reduce external component count.

Choosing this part means leveraging Cyclone V device family capabilities and development resources to accelerate time-to-market for industrial, communications, and ruggedized embedded systems without sacrificing integration or thermal margin.

Request a quote or submit a pricing inquiry to get availability and lead-time information for the 5CEFA5M13I7N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up