5CEFA5U19C6N

The 5CEFA5U19C6N is a Cyclone® V E series FPGA from Intel, delivering a mid-range FPGA fabric optimized for low power and system integration. Built on a 28 nm low-power process and featuring integrated transceivers and hard memory controllers, this device targets high-volume, cost-sensitive applications in industrial, wireless and wireline, and military markets.

This device combines substantial logic capacity and embedded memory with a compact 484-FBGA package and 224 general-purpose I/O to enable space-efficient, scalable designs that require a balance of performance and power efficiency.

Key Features

• Logic Capacity — 77,000 logic elements to support complex programmable logic functions and mid-density system integration.
• Embedded Memory — Approximately 5.0 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage without external memory in many designs.
• I/O and Package — 224 general-purpose I/O pins in a 484-FBGA (484-UBGA, 19×19) package, surface-mount compatible for compact board-level integration.
• Process and Core Voltage — Built on TSMC 28 nm low-power technology with a documented supply range of 1.07 V to 1.13 V (nominal 1.1 V core), optimized for reduced power consumption.
• Operating Range — Commercial-grade operation over 0 °C to 85 °C for typical commercial and enterprise applications.
• System Integration — Family-level features include integrated transceivers and hard memory controllers to simplify high-bandwidth interfaces and memory subsystems.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial automation — Implement I/O aggregation, protocol bridging, and real-time control logic using the device’s logic capacity and on-chip RAM.
• Wireless infrastructure — Use integrated transceivers and hard memory controllers for data path processing and fronthaul/transport functions.
• Wireline communications — Deploy the device for packet processing, interface bridging, and medium-density switching applications.
• Defense and military systems — Employ the Cyclone V E fabric where programmable logic, embedded memory, and compact packaging enable rugged subsystem designs (commercial-grade temperature range applies).

Unique Advantages

• High logic density: 77,000 logic elements provide the capacity to implement substantial custom logic and mid-complexity SoC functions on a single device.
• On-chip memory: Approximately 5.0 Mbits of embedded RAM reduces dependence on external memory for many buffering and local storage tasks, simplifying PCB layout and BOM.
• Compact, production-friendly package: 484-FBGA (19×19) surface-mount packaging enables high-pin-count I/O in a compact footprint for space-constrained boards.
• Low-power process: 28 nm low-power technology and a 1.07–1.13 V supply window help optimize power consumption for cost-sensitive designs.
• Broad interfacing capability: 224 I/O pins and family-level support for integrated transceivers and memory controllers streamline high-speed and parallel interfacing requirements.
• Commercial readiness: Commercial temperature grade (0 °C to 85 °C) and RoHS compliance for mainstream product lines.

Why Choose 5CEFA5U19C6N?

The 5CEFA5U19C6N positions itself as a practical, power-conscious FPGA choice for designers needing substantial logic resources and embedded memory in a compact, production-ready package. Its 28 nm low-power process, integrated system-level features, and 224 I/O pins make it well suited to mid-density applications where board space, power, and integration matter.

Ideal for engineering teams developing industrial, wireless/wireline, and defense-class solutions that require a balance of programmable logic capacity, on-chip memory, and a compact footprint—backed by the Cyclone V family documentation and Intel’s device ecosystem.

Request a quote or submit a quote for pricing and availability of the 5CEFA5U19C6N to begin integrating this Cyclone V E FPGA into your next design.