5CEFA7F23C6N
| Part Description |
Cyclone® V E Field Programmable Gate Array (FPGA) IC 240 7880704 149500 484-BGA |
|---|---|
| Quantity | 997 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 240 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56480 | Number of Logic Elements/Cells | 149500 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7880704 |
Overview of 5CEFA7F23C6N – Cyclone® V E FPGA, 484-BGA, 240 I/O
The 5CEFA7F23C6N is an Intel Cyclone V E field-programmable gate array delivered in a 484-ball fine-pitch BGA (23 × 23) surface-mount package. It provides a substantial programmable fabric with 149,500 logic elements and approximately 7.88 Mbits of embedded memory, suited for designs that require mid-to-high density programmable logic and flexible I/O routing.
Built on the Cyclone V family architecture, this device targets cost- and power-sensitive applications that need integrated logic capacity, on-chip memory, and a dense I/O footprint while operating within a commercial temperature range.
Key Features
- Logic Capacity — 149,500 logic elements to implement complex custom logic, glue logic, and protocol handling.
- Embedded Memory — Approximately 7.88 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
- I/O — 240 general-purpose I/O pins to support wide parallel interfaces and multiple peripheral connections.
- Power and Core Voltage — Core supply range 1.07 V to 1.13 V (Cyclone V family nominal core voltage noted as 1.1 V), enabling low-voltage system designs.
- Package and Mounting — 484-FBGA (23×23) in a 484-BGA package, surface-mount for compact board-level integration.
- Operating Range and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Family-level Architecture — Based on Cyclone V device architecture with enhanced ALM structure and variable-precision DSP capabilities described in the Cyclone V device documentation.
- Compliance — RoHS-compliant for lead-free manufacturing requirements.
Typical Applications
- Wireless and Wireline Communications — Implements protocol processing, packet handling, and custom interface logic where mid-range programmable capacity and dense I/O are required.
- Custom Signal Processing — Local buffering and DSP-oriented logic leveraging the device's logic elements and embedded memory for algorithm acceleration and data flow control.
- High-density I/O Systems — Acts as a connectivity hub for systems requiring dozens to hundreds of parallel signals and mixed-interface routing.
- Cost-sensitive, Volume Designs — Suitable for designs that prioritize low system cost and power efficiency while retaining the flexibility of an FPGA-based implementation.
Unique Advantages
- Substantial Logic Resources: 149,500 logic elements let you integrate large amounts of custom logic in a single device, reducing board-level complexity.
- On-chip Memory for Data Path Efficiency: Approximately 7.88 Mbits of embedded RAM minimizes external memory dependence and improves deterministic data handling.
- High I/O Count: 240 I/O pins provide the routing capacity needed for multi-interface designs and parallel data streams.
- Low-Voltage Core: Narrow core supply window (1.07–1.13 V) aligned with Cyclone V family low-power operation to help reduce overall system power.
- Compact, Board-friendly Package: 484-FBGA (23×23) surface-mount package supports dense, space-constrained PCB layouts.
- Regulatory and Manufacturing Fit: RoHS compliance supports modern lead-free assembly processes.
Why Choose 5CEFA7F23C6N?
The 5CEFA7F23C6N combines large programmable logic capacity, meaningful on-chip memory, and a high I/O count in a compact 484-BGA footprint, making it a practical choice for designers building cost- and power-conscious systems that still require significant customization and interface flexibility. Its commercial-grade operating range and RoHS compliance align with mainstream production environments.
This Cyclone V E device is well suited to engineers who need to scale logic and memory resources without moving to higher-cost families, and who value the balance of integration and board-level density for mid-to-high complexity applications.
Request a quote or submit a product inquiry to receive pricing and availability for the 5CEFA7F23C6N. Provide your required quantities and delivery timeframe for a tailored response.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018