5CEFA5U19C7N

The 5CEFA5U19C7N is an Intel Cyclone® V E field programmable gate array in a 484‑FBGA (484‑UBGA 19×19) package. It combines a high-density logic fabric with on‑chip embedded memory and flexible I/O to support bandwidth‑focused and cost‑sensitive applications.

Built on a 28‑nm low‑power process with a 1.1 V core (operating supply 1.07 V to 1.13 V), this device targets designs that require sizable logic capacity, substantial embedded RAM, and a compact surface‑mount package.

Key Features

• Logic Capacity — 77,000 logic elements for implementing complex digital functions and state machines.
• Adaptive Logic Modules (ALMs) — 29,080 ALMs provide the underlying resources for efficient LUT and register utilization.
• Embedded Memory — Approximately 5.00 Mbits of on‑chip RAM for buffering, FIFOs, and embedded data structures.
• I/O and Packaging — 224 I/O pins in a 484‑FBGA (484‑UBGA, 19×19) surface‑mount package for dense board integration and signal routing.
• Power — Core supply range 1.07 V to 1.13 V (typical 1.1 V), designed on TSMC 28‑nm low‑power (28LP) process technology.
• Temperature and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS‑compliant for environmental and manufacturing compatibility.

Typical Applications

• Wireless and wireline communications — Implements protocol engines, data path processing, and interface bridging where logic density and embedded RAM reduce external memory requirements.
• High‑performance embedded systems — Provides programmable fabric and memory to accelerate custom algorithms and offload processor tasks in compact designs.
• Military and defense systems — Offers a combination of logic capacity, on‑chip RAM, and a compact package suitable for space‑constrained, mission‑oriented hardware (commercial grade).

Unique Advantages

• High logic density: 77,000 logic elements enable complex designs without immediate upsizing to larger families.
• Substantial on‑chip RAM: Approximately 5.00 Mbits of embedded memory reduces dependency on external memory devices and simplifies BOM.
• Flexible I/O in a compact package: 224 I/O in a 484‑FBGA (19×19) footprint supports dense board routing while keeping the PCB area small.
• Low‑voltage core: Narrow supply window (1.07 V–1.13 V) tuned to 28‑nm low‑power operation helps manage power budget in system designs.
• RoHS compliant: Meets common environmental requirements for modern electronics manufacturing.
• Commercial operating range: Rated for 0 °C to 85 °C to match standard commercial deployment environments.

Why Choose 5CEFA5U19C7N?

The 5CEFA5U19C7N places significant programmable resources—77,000 logic elements, 29,080 ALMs, and approximately 5.00 Mbits of on‑chip RAM—into a compact 484‑FBGA package with 224 I/O. Its 28‑nm low‑power heritage and tightly specified core supply make it a practical option for designers balancing performance, power, and board area.

This device is well suited for teams building bandwidth‑focused, cost‑sensitive systems where integrated logic, embedded memory, and flexible I/O simplify board design and reduce system BOM. Its commercial temperature rating and RoHS compliance support mainstream deployments and manufacturing workflows.

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