5CEFA5M13C8N

The 5CEFA5M13C8N is an Intel Cyclone® V E series Field Programmable Gate Array (FPGA) in a 383-TFBGA package. It provides a mid-range FPGA fabric with 77,000 logic elements and approximately 5.0 Mbits of embedded memory, designed for systems that require a balance of integration, power efficiency, and I/O density.

Built for cost-sensitive, bandwidth-conscious applications across industrial, wireless and wireline, military, and automotive markets (series-level suitability), this device pairs on-chip memory and configurable logic with flexible I/O in a compact surface-mount package.

Key Features

• Logic Capacity — 77,000 logic elements (LEs) to implement complex combinational and sequential logic functions.
• Embedded Memory — Total RAM of 5,001,216 bits (approximately 5.0 Mbits) for on-chip buffers, FIFOs, and state storage.
• I/O Density — 175 general-purpose I/Os to support high-pin-count interfaces and board-level connectivity.
• Process and Core Voltage — Fabric built on a 28 nm low-power process with a device supply range of 1.07 V to 1.13 V (series-level 1.1 V core reference).
• Packaging & Mounting — Surface-mount 383-TFBGA package; supplier device package referenced as 383-MBGA (13×13).
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Series-Level Architecture — Cyclone V family features such as enhanced 8‑input adaptive logic modules (ALMs), M10K 10-kbit embedded memory blocks with ECC options, integrated transceivers and hard memory controllers (series-level capabilities).
• Standards & Compliance — RoHS compliant for environmental compliance in assembly and manufacturing.

Typical Applications

• Industrial Control — Implement motor control, sensor aggregation, and deterministic I/O processing using the device’s logic density and on-chip memory.
• Wireless & Wireline Infrastructure — Use embedded memory and series-level integrated transceivers and hard memory controllers to support data buffering and protocol handling in communications equipment.
• Military & Aerospace Systems — Leverage the Cyclone V series’ balance of integration and power efficiency for processing and interface tasks in mission-focused subsystems.
• Automotive Market Designs — Applicable to automotive market designs at the series level for high-bandwidth interfaces and controller functions (device is specified as commercial grade).

Unique Advantages

• Significant Logic and Memory Capacity: 77,000 logic elements combined with approximately 5.0 Mbits of embedded RAM supports sizeable designs without immediate need for external memory.
• Flexible I/O Count: 175 I/Os allow connectivity to a wide range of peripherals, sensors, and board-level interfaces, reducing the need for additional interface chips.
• Low‑Power 28 nm Process: Fabricated on a 28 nm low-power process with a nominal 1.1 V core range and specified supply range of 1.07–1.13 V, enabling lower power consumption compared with previous generations (series-level improvement).
• Compact, Surface-Mount Packaging: 383-TFBGA (supplier 383-MBGA 13×13) delivers a high-density footprint suited for space-constrained PCBs.
• Series-Level Integration Options: Cyclone V family features such as adaptive ALMs, M10K memory blocks with ECC, integrated transceivers, and hard memory controllers give design teams options to simplify system architecture and reduce BOM.
• Regulatory Compliance: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose 5CEFA5M13C8N?

The 5CEFA5M13C8N delivers a balanced mix of logic capacity, embedded memory, and I/O density in a compact 383-TFBGA surface-mount package. Its 77,000 logic elements and approximately 5.0 Mbits of on-chip RAM make it well suited for mid-range FPGA implementations where integration and power efficiency are important.

This Cyclone V E device is a practical choice for engineering teams developing cost-sensitive, bandwidth-oriented systems across industrial, communications, military, and automotive market segments at the series level, offering a path to scale and simplify designs while meeting commercial operating conditions.

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