5SEEBH40C2N

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V E Field Programmable Gate Array (FPGA) IC 696 53248000 952000 1517-BBGA, FCBGA

Quantity 603 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359250Number of Logic Elements/Cells952000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SEEBH40C2N – Stratix V E FPGA, 952,000 logic elements, 696 I/O, 1517-BBGA (45×45)

The 5SEEBH40C2N is an Intel Stratix® V E field-programmable gate array (FPGA) packaged in a 1517-BBGA FCBGA (supplier package: 1517-HBGA, 45×45) for surface-mount applications. As a member of the Stratix V family, the E variant delivers very high logic density and an architecture designed for compute- and memory-intensive system designs.

This device targets designs that require large programmable logic capacity, substantial embedded memory, and extensive I/O connectivity—making it suitable for system emulation, diagnostic imaging, instrumentation, and other high-density FPGA applications.

Key Features

  • High Logic Density — 952,000 logic elements, enabling large-scale, complex FPGA implementations and system-level integration.
  • Embedded Memory — Approximately 53 Mbits of on-chip RAM (53,248,000 bits) provided by Stratix V embedded memory blocks for large buffer and state storage requirements.
  • Extensive I/O — 696 device I/O pins to support broad interfacing and high pin-count board designs.
  • Core and Fabric Architecture — Stratix V family innovations including an enhanced core architecture with adaptive logic modules (ALMs) and variable-precision DSP blocks to support compute-intensive workloads.
  • High-performance Building Blocks — 20-Kbit M20K embedded memory blocks, variable-precision DSP blocks, and fractional PLLs for robust timing and signal-processing functions.
  • Embedded Hard IP — Integrated hard IP and an Embedded HardCopy Block for hardening IP instantiations and enabling a low-risk path to HardCopy V ASICs for production scaling.
  • Process and Power — Built on 28-nm process technology with a documented core supply range of 0.870 V to 0.930 V to align with low-voltage core requirements.
  • Package & Mounting — 1517-BBGA, FCBGA package, surface-mount mounting type, supplier package 1517-HBGA (45×45) for high-density board integration.
  • Commercial Grade & Temperature Range — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • RoHS Compliant — Conforms to RoHS requirements for lead-free assembly and regulatory compliance.

Typical Applications

  • System Emulation and Prototyping — Large logic capacity and extensive I/O make this device suitable for emulating complex SoCs and hardware platforms prior to ASIC production.
  • Diagnostic Imaging — High logic density and substantial on-chip memory support real-time image processing pipelines and buffering requirements.
  • Instrumentation and Test Equipment — Rich DSP resources and broad I/O counts enable high-performance signal processing and multi-channel data acquisition systems.
  • High-density FPGA Designs — Ideal for designs that consolidate multiple functions into a single FPGA, reducing system BOM and simplifying board-level integration.

Unique Advantages

  • Large-Scale Integration: 952,000 logic elements and approximately 53 Mbits of embedded memory allow integration of complex functions and large state machines on a single device.
  • Extensive Connectivity: 696 I/Os provide flexibility for multi-channel interfaces, high-pin-count connectors, and dense board routing.
  • Architecture Optimized for Performance: Stratix V building blocks—ALMs, M20K memory blocks, DSP resources, and PLLs—offer the primitives needed for demanding compute and signal-processing tasks.
  • Production Path to HardCopy ASICs: The Embedded HardCopy Block and family-level support provide a defined migration path from FPGA prototype to HardCopy V ASICs for volume production.
  • Compact, Surface-Mount Packaging: 1517-BBGA (45×45) FCBGA package supports high I/O density in a compact footprint for space-constrained systems.
  • Regulatory and Assembly Friendly: RoHS compliance and commercial-grade temperature rating simplify procurement and standard assembly processes.

Why Choose 5SEEBH40C2N?

The 5SEEBH40C2N brings Stratix V E class density and architecture to designs that demand large programmable logic capacity, significant on-chip memory, and broad I/O connectivity. Its combination of nearly one million logic elements, substantial embedded RAM, and Stratix V fabric primitives supports complex DSP, emulation, and instrumentation workloads.

For development teams planning production scaling, this Stratix V E device also aligns with a low-risk migration path to HardCopy V ASICs. The device suits customers seeking a high-density, commercially graded FPGA platform with the integration and architecture needed for advanced system designs.

Request a quote or submit an inquiry to receive pricing and availability for the 5SEEBH40C2N.

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