5SEEBH40C3N

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V E Field Programmable Gate Array (FPGA) IC 696 53248000 952000 1517-BBGA, FCBGA

Quantity 927 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359250Number of Logic Elements/Cells952000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SEEBH40C3N – Stratix® V E Field Programmable Gate Array (FPGA) IC

The 5SEEBH40C3N is a Stratix V E field programmable gate array offering a high logic density FPGA fabric built on the Stratix V architecture. It combines a large number of logic elements, abundant embedded memory, and extensive I/O to address designs that require substantial programmable logic capacity and system integration.

This device is suited for applications such as ASIC and system emulation, diagnostic imaging, and instrumentation where nearly one million logic elements, significant on‑chip memory, and broad I/O count are required. The device is supplied in a 1517‑BBGA FCBGA package for surface-mount assembly and is specified for commercial temperature operation.

Key Features

  • Logic Capacity  Provides 952,000 logic elements for implementing large-scale programmable logic and complex system functions.
  • Embedded Memory  Approximately 53 Mbits of on-chip RAM (total RAM bits: 53,248,000) using Stratix V memory architecture including M20K memory blocks.
  • I/O Density  Up to 696 device I/Os to support wide parallel interfaces, board-level connectivity, and dense signal routing.
  • DSP and Hard IP  Includes variable precision DSP resources and integrated hard IP blocks; the family also supports an Embedded HardCopy Block for hardening IP such as PCIe generations.
  • Transceiver and Fabric Technology  Stratix V family innovations include integrated transceivers (family-level capability up to 28.05 Gbps) and an adaptive logic module (ALM) based fabric with multi-track routing.
  • Process and Clocking  Built on 28‑nm process technology with fractional PLLs and a comprehensive fabric clocking network for flexible timing architectures.
  • Power Supply  Specified core voltage range of 820 mV to 880 mV to match system power-rail requirements.
  • Package & Mounting  1517‑BBGA (FCBGA) / supplier package 1517‑HBGA (45×45) in a surface-mount form factor for high-density board integration.
  • Operating Range & Compliance  Commercial grade operation from 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • ASIC and System Emulation  Use the 952,000 logic elements and extensive memory to prototype, validate, or emulate large ASIC designs and complex SoCs.
  • Diagnostic Imaging  Leverage abundant DSP resources and on-chip memory for real-time image processing pipelines and high-throughput data handling.
  • Instrumentation  High I/O count and programmable logic capacity enable custom measurement, control, and data-aggregation systems for lab and industrial instruments.
  • High‑bandwidth Transport and Processing  Family features such as integrated transceivers and hardened IP blocks support bandwidth‑centric data transport and protocol processing tasks.

Unique Advantages

  • Large Programmable Fabric: 952,000 logic elements provide the headroom to implement complex logic, datapaths, and system-level functions without partitioning across multiple devices.
  • Substantial On‑chip Memory: Approximately 53 Mbits of embedded RAM reduce external memory dependence and simplify board-level BOM and routing.
  • High I/O Count: 696 I/Os enable dense peripheral and bus connections, simplifying integration with multi-channel front ends and parallel interfaces.
  • Family-Level Hard IP and DSP: Integrated hard IP blocks and variable precision DSP resources allow efficient implementation of compute- and protocol-intensive functions.
  • Commercial Temperature and RoHS Compliance: Specified 0 °C to 85 °C operation and RoHS compliance support standard commercial deployments and manufacturing requirements.
  • Compact Surface-Mount Package: 1517‑BBGA (45×45 HBGA footprint) provides a high-density package option for space-constrained PCBs.

Why Choose 5SEEBH40C3N?

The 5SEEBH40C3N is positioned for designs that demand a large programmable fabric, extensive on-chip memory, and high I/O density in a commercial-grade, surface-mount package. Its Stratix V architecture delivers a combination of logic, memory, DSP, and family-level hard IP capabilities that simplify implementing complex algorithms and protocol handling on a single device.

This part is appropriate for engineering teams building emulation platforms, imaging systems, instrumentation, and other data- or logic‑intensive applications that require a high logic element count, substantial embedded RAM, and broad connectivity while adhering to commercial temperature and RoHS manufacturing constraints.

If you would like pricing, availability, or a technical quotation for 5SEEBH40C3N, submit a request for a quote or an inquiry and our team will respond with the requested details.

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