5SGSED6K2F40C2G

The 5SGSED6K2F40C2G is a Stratix® V GS Field Programmable Gate Array (FPGA) in a 1517-BBGA (1517-FBGA 40×40) surface-mount package. This commercial-grade FPGA delivers high logic density, substantial on-chip memory, and a large I/O count for complex, high-performance digital designs.

With 583,000 logic elements, approximately 46.08 Mbits of embedded memory, and 696 programmable I/Os, the device is intended for applications that require extensive programmable logic resources, embedded memory, and broad system connectivity within a compact BGA footprint.

Key Features

• Core Logic — 583,000 logic elements for high-density programmable logic and complex combinational/sequential designs.
• Embedded Memory — Approximately 46.08 Mbits of on-chip RAM to support large data buffers, state machines, and memory-intensive algorithms.
• High I/O Count — 696 I/O pins to support extensive peripheral interfacing, parallel buses, and multi-channel connectivity.
• Power Supply — Core voltage supply range of 870 mV to 930 mV, enabling integration into low-voltage power domains.
• Package & Mounting — 1517-BBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount FCBGA form factor for board-level integration and dense PCB routing.
• Temperature & Grade — Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory — RoHS-compliant.

Typical Applications

• High-density digital processing — Use the large logic element count and on-chip memory for compute-heavy FPGA functions, data path processing, and custom accelerators.
• Multi-channel I/O systems — 696 I/Os enable implementation of wide parallel buses, multiport interfaces, and extensive sensor or peripheral connectivity.
• Embedded memory-centric designs — Approximately 46.08 Mbits of embedded memory supports buffering, packet processing, and real-time data storage requirements.

Unique Advantages

• High logic density: 583,000 logic elements provide the resources to consolidate complex logic into a single FPGA, reducing external components.
• Substantial embedded memory: Approximately 46.08 Mbits of on-chip RAM simplifies system memory architecture and lowers external memory dependencies.
• Extensive I/O capability: 696 I/Os let you connect many peripherals or implement wide parallel interfaces without additional I/O expanders.
• Compact BGA package: 1517-BBGA (1517-FBGA 40×40) delivers a high-pin-count solution in a space-efficient package suitable for dense PCB layouts.
• Commercial temperature rating: 0 °C to 85 °C specified for standard commercial deployments.
• RoHS compliance: Environmentally compliant for markets requiring lead-free assembly.

Why Choose 5SGSED6K2F40C2G?

The 5SGSED6K2F40C2G combines substantial programmable logic resources, abundant on-chip RAM, and a very high I/O count in a compact 1517-BBGA package, making it a practical choice for designers who need to integrate complex digital functions and broad connectivity on a single device. Its commercial-grade temperature range and RoHS compliance align with standard electronics manufacturing requirements.

This device is well suited to development teams and system integrators building high-density FPGA designs that benefit from consolidated logic, embedded memory, and extensive I/O in a surface-mount BGA form factor.

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