5SGSED6K2F40C2LG
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 479 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 220000 | Number of Logic Elements/Cells | 583000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGSED6K2F40C2LG – Stratix V GS FPGA — 583,000 logic elements, ~46 Mbits RAM, 696 I/Os, 1517‑BBGA
The 5SGSED6K2F40C2LG is a Stratix® V GS field programmable gate array (FPGA) in a 1517‑BBGA FCBGA package intended for commercial applications. It delivers high logic density, substantial on‑chip RAM, and a large I/O count for complex system integration where a compact, surface‑mount FPGA is required.
This device targets designs that need large programmable logic capacity, significant embedded memory, and extensive I/O connectivity while operating within commercial temperature limits and RoHS‑compliant supply chains.
Key Features
- Logic Capacity Approximately 583,000 logic elements for implementing large-scale digital functions and complex custom logic.
- Embedded Memory Approximately 46 Mbits of on‑chip RAM to support buffering, packet processing, and state storage without external memory.
- I/O Density Up to 696 general‑purpose I/Os to interface with multiple peripherals, high‑pin‑count daughtercards, or dense backplane connections.
- Package & Mounting 1517‑BBGA (supplier package: 1517‑FBGA, 40×40) in a surface‑mount FCBGA format for compact board integration.
- Power Supply Core voltage range 820 mV to 880 mV, enabling expected Stratix V core operating conditions.
- Operating Temperature Commercial grade operation from 0 °C to 85 °C for standard environmental requirements.
- Compliance RoHS compliant for conformity with common environmental regulations.
Typical Applications
- High‑density logic systems Implement large custom datapaths, control logic, or state machines using up to 583,000 logic elements and substantial embedded RAM.
- High I/O interface designs Support complex multi‑bus or multi‑peripheral designs that require up to 696 I/Os in a single compact package.
- On‑chip memory‑centric functions Use approximately 46 Mbits of embedded memory for buffering, packet queues, or local storage to minimize external memory dependence.
- Commercial electronic systems Deploy in applications operating within 0 °C to 85 °C where RoHS compliance and surface‑mount packaging are required.
Unique Advantages
- High integration density: Combines hundreds of thousands of logic elements with large embedded RAM to reduce external component count and simplify board design.
- Large I/O capacity: Up to 696 I/Os provide flexibility for parallel interfaces, GPIO expansion, and high‑pin‑count interconnects.
- Compact, assembly‑friendly package: 1517‑BBGA FCBGA in a 40×40 supplier footprint supports high‑density PCB layouts and automated surface‑mount assembly.
- Commercial temperature range: Rated for 0 °C to 85 °C operation to match standard commercial product requirements.
- Regulatory readiness: RoHS compliance supports environmentally responsible manufacturing and supply‑chain requirements.
Why Choose 5SGSED6K2F40C2LG?
This Stratix V GS FPGA balances substantial programmable logic, considerable embedded memory, and extensive I/O in a compact surface‑mount BGA package for commercial designs. It is appropriate for engineers and system designers who need to consolidate complex functions into a single, high‑density FPGA while maintaining standard commercial operating conditions and RoHS compliance.
Choose the 5SGSED6K2F40C2LG when your design requires scalable logic resources, large on‑chip RAM capacity, and broad interface flexibility in a package suited to modern PCB assembly and compact system layouts.
Request a quote or submit a sourcing inquiry to evaluate lead times, pricing, and availability for the 5SGSED6K2F40C2LG.

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