5SGSED6K2F40C2LG

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA

Quantity 479 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSED6K2F40C2LG – Stratix V GS FPGA — 583,000 logic elements, ~46 Mbits RAM, 696 I/Os, 1517‑BBGA

The 5SGSED6K2F40C2LG is a Stratix® V GS field programmable gate array (FPGA) in a 1517‑BBGA FCBGA package intended for commercial applications. It delivers high logic density, substantial on‑chip RAM, and a large I/O count for complex system integration where a compact, surface‑mount FPGA is required.

This device targets designs that need large programmable logic capacity, significant embedded memory, and extensive I/O connectivity while operating within commercial temperature limits and RoHS‑compliant supply chains.

Key Features

  • Logic Capacity  Approximately 583,000 logic elements for implementing large-scale digital functions and complex custom logic.
  • Embedded Memory  Approximately 46 Mbits of on‑chip RAM to support buffering, packet processing, and state storage without external memory.
  • I/O Density  Up to 696 general‑purpose I/Os to interface with multiple peripherals, high‑pin‑count daughtercards, or dense backplane connections.
  • Package & Mounting  1517‑BBGA (supplier package: 1517‑FBGA, 40×40) in a surface‑mount FCBGA format for compact board integration.
  • Power Supply  Core voltage range 820 mV to 880 mV, enabling expected Stratix V core operating conditions.
  • Operating Temperature  Commercial grade operation from 0 °C to 85 °C for standard environmental requirements.
  • Compliance  RoHS compliant for conformity with common environmental regulations.

Typical Applications

  • High‑density logic systems  Implement large custom datapaths, control logic, or state machines using up to 583,000 logic elements and substantial embedded RAM.
  • High I/O interface designs  Support complex multi‑bus or multi‑peripheral designs that require up to 696 I/Os in a single compact package.
  • On‑chip memory‑centric functions  Use approximately 46 Mbits of embedded memory for buffering, packet queues, or local storage to minimize external memory dependence.
  • Commercial electronic systems  Deploy in applications operating within 0 °C to 85 °C where RoHS compliance and surface‑mount packaging are required.

Unique Advantages

  • High integration density: Combines hundreds of thousands of logic elements with large embedded RAM to reduce external component count and simplify board design.
  • Large I/O capacity: Up to 696 I/Os provide flexibility for parallel interfaces, GPIO expansion, and high‑pin‑count interconnects.
  • Compact, assembly‑friendly package: 1517‑BBGA FCBGA in a 40×40 supplier footprint supports high‑density PCB layouts and automated surface‑mount assembly.
  • Commercial temperature range: Rated for 0 °C to 85 °C operation to match standard commercial product requirements.
  • Regulatory readiness: RoHS compliance supports environmentally responsible manufacturing and supply‑chain requirements.

Why Choose 5SGSED6K2F40C2LG?

This Stratix V GS FPGA balances substantial programmable logic, considerable embedded memory, and extensive I/O in a compact surface‑mount BGA package for commercial designs. It is appropriate for engineers and system designers who need to consolidate complex functions into a single, high‑density FPGA while maintaining standard commercial operating conditions and RoHS compliance.

Choose the 5SGSED6K2F40C2LG when your design requires scalable logic resources, large on‑chip RAM capacity, and broad interface flexibility in a package suited to modern PCB assembly and compact system layouts.

Request a quote or submit a sourcing inquiry to evaluate lead times, pricing, and availability for the 5SGSED6K2F40C2LG.

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