5SGSED6K2F40C3N

The 5SGSED6K2F40C3N is an Intel Stratix V GS field-programmable gate array (FPGA) in a 1517‑BBGA FCBGA package. Built on the Stratix V family architecture, it delivers a high-logic-capacity, DSP-optimized platform with integrated transceiver capability suited for transceiver‑based and DSP‑centric designs.

This device targets data‑intensive and high‑performance markets where large logic arrays, significant on‑chip memory, and high‑speed I/O are required—enabling applications such as high‑precision DSP, backplane and optical interfaces, and advanced communications systems.

Key Features

• Core architecture  28‑nm Stratix V family architecture with adaptive logic modules (ALMs) and a comprehensive fabric clocking network.
• Logic capacity  583,000 logic elements to implement large-scale, performance‑oriented designs.
• Embedded memory  Approximately 46 Mbits of on‑chip RAM implemented in 20 Kbit (M20K) memory blocks for buffering and storage.
• Variable‑precision DSP  Series includes abundant variable‑precision DSP blocks (series‑level capability detailed in the Stratix V documentation).
• Integrated transceivers  GS devices in the Stratix V family provide integrated transceivers with up to 14.1 Gbps data‑rate capability for backplane and optical interfaces.
• I/O and package  696 user I/O pins in a 1517‑BBGA (1517‑FBGA, 40×40) surface‑mount package for dense connectivity.
• Power  Core supply voltage specified from 820 mV to 880 mV for core power domains.
• Commercial grade  Operating temperature range 0 °C to 85 °C; RoHS compliant.
• System integration  Embedded HardCopy block and fractional PLLs are part of the Stratix V series feature set for system timing and hardened IP integration.

Typical Applications

• High‑performance DSP and compute  Variable‑precision DSP blocks and large logic density support broadcast, high‑performance computing, and signal processing workloads.
• Optical and backplane communications  Integrated transceivers with multi‑Gbps capability enable 40G/100G transport and backplane interface implementations.
• Wireline and military communications  Device architecture and transceiver support are applicable to demanding wireline and communications equipment designs.
• Packet processing and network systems  Large embedded memory and extensive I/O enable packet buffering, traffic management, and protocol handling.

Unique Advantages

• High logic density: 583,000 logic elements provide the silicon resource to integrate complex, multi‑function systems on a single device.
• Substantial on‑chip memory: Approximately 46 Mbits of embedded RAM reduces external memory dependency and improves bandwidth for packet and DSP workflows.
• DSP‑oriented architecture: The Stratix V GS series includes a large array of variable‑precision DSP resources, enabling efficient implementation of multiply‑intensive algorithms.
• Integrated high‑speed I/O: 696 I/O pins and series transceiver capability simplify interface design for high‑bandwidth communication links.
• Compact, surface‑mount package: 1517‑BBGA (40×40) packaging balances pin density with board‑level integration for space‑constrained systems.
• Commercial qualification and compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial deployments.

Why Choose 5SGSED6K2F40C3N?

The 5SGSED6K2F40C3N positions designers to implement DSP‑centric, transceiver‑enabled systems that require large logic arrays, significant on‑chip memory, and extensive I/O connectivity. As a member of the Stratix V GS family, it combines the series’ DSP resources and transceiver capability with a high logic element count to address data‑intensive applications.

Choose this device when your design demands high logic capacity, embedded memory for buffering, and integrated multi‑Gbps interfaces—while retaining a commercial‑grade operating range and RoHS compliance. The Stratix V family also provides a documented route for prototyping and transition to HardCopy V ASICs when applicable.

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