5SGSED6K2F40C3G

The 5SGSED6K2F40C3G is an Intel Stratix® V GS field programmable gate array (FPGA) in a 1517-BBGA (FCBGA) package. It provides a high-density programmable logic fabric with 583,000 logic elements and approximately 46 Mbits of embedded memory for complex digital designs.

Designed for commercial-temperature applications, this device delivers a large I/O count and a compact surface-mount package to support designs that require significant on-chip resources and extensive external connectivity.

Key Features

• Core logic — 583,000 logic elements to implement large-scale custom logic and complex state machines.
• Embedded memory — Approximately 46 Mbits of on-chip RAM for buffering, FIFOs, and data storage without external memory.
• I/O density — 696 user I/Os to support wide parallel interfaces and multiple external peripherals.
• Package and mounting — 1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40); surface-mount for PCB integration.
• Power — Core voltage supply range 820 mV to 880 mV for operating the FPGA core within specified limits.
• Temperature and grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Series characteristics — Part of the Stratix V family (GS devices) as documented in the Stratix V device datasheet, which details family-level electrical and transceiver speed grade information.
• RoHS compliant — Conforms to RoHS requirements for regulatory compliance.

Typical Applications

• High-density programmable logic — Implement large, custom digital systems that need extensive logic resources and embedded RAM.
• Multi-interface designs — Use the 696 I/Os to connect multiple parallel interfaces, sensors, or peripherals on a single FPGA.
• Embedded memory-dependent functions — Leverage approximately 46 Mbits of on-chip RAM for buffering, packet handling, and data staging without immediate external memory.

Unique Advantages

• Substantial logic capacity — 583,000 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level component count.
• Large on-chip RAM — Approximately 46 Mbits of embedded memory reduces reliance on external memory and simplifies memory subsystem design.
• High I/O count — 696 I/Os provide flexibility for parallel interfaces and extensive external connectivity options.
• Compact FCBGA package — 1517-BBGA (1517-FBGA supplier package) allows a high-density solution in a surface-mount package for compact PCB layouts.
• Commercial temperature rating — Specified 0 °C to 85 °C operating range for standard commercial applications.
• Regulatory compliance — RoHS compliant to meet environmental requirements.

Why Choose 5SGSED6K2F40C3G?

The 5SGSED6K2F40C3G combines a high logic-element count, significant embedded RAM, and a large I/O complement in a compact FCBGA package—making it a fit for designs that need substantial on-chip resources and broad external connectivity within a commercial temperature envelope. As part of the Stratix V GS family, it aligns with the series-level electrical and transceiver specifications documented in the Stratix V device datasheet.

This device is suitable for engineering teams and procurement seeking a high-density FPGA solution from Intel with verifiable on-chip resources and clear operating and packaging specifications for integration into commercial products.

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