5SGSED6K2F40I2G
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 801 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 220000 | Number of Logic Elements/Cells | 583000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGSED6K2F40I2G – Stratix® V GS Field Programmable Gate Array (FPGA) IC
The 5SGSED6K2F40I2G is a Stratix® V GS field-programmable gate array (FPGA) from Intel designed for high-density, high-I/O embedded logic applications. As an industrial-grade device, it combines a large logic capacity with substantial on‑chip memory and a wide set of I/O to support complex digital systems.
This surface-mount FCBGA device provides designers with high integration, deterministic operating conditions, and a broad operating-temperature range for demanding environments.
Key Features
- Core Logic Approximately 583,000 logic elements to implement large-scale digital designs and complex custom logic functions.
- Embedded Memory Approximately 46 Mbits of on-chip RAM for buffering, lookup tables, and local data storage without external memory.
- I/O Density 696 user I/O pins to support multi-channel interfaces and dense board-level connectivity.
- Power Core supply voltage range from 870 mV to 930 mV, enabling targeted power-domain design and integration with system power architectures.
- Package & Mounting 1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), and surface-mount mounting for compact PCB implementations.
- Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in industrial environments.
- Compliance RoHS-compliant manufacturing to meet common environmental requirements.
Typical Applications
- High-density digital processing Use where a large number of logic elements and on-chip RAM are required to implement complex data paths and custom accelerators.
- Multi-channel I/O aggregation Ideal for designs that need hundreds of I/O signals—supporting aggregation, protocol bridging, and interface concentrators.
- Industrial control and instrumentation Industrial-grade temperature range and robust packaging make the device suitable for control systems and instrumentation operating across wide temperatures.
Unique Advantages
- High logic capacity: Approximately 583,000 logic elements reduce the need for multiple devices and simplify partitioning of large designs.
- Substantial embedded memory: Approximately 46 Mbits of on-chip RAM supports local buffering and state storage without immediate dependence on external memory components.
- Extensive I/O availability: 696 I/O pins enable direct connection to multiple peripherals and high-bandwidth front‑end interfaces.
- Industrial-grade operation: Rated for −40 °C to 100 °C, suitable for systems requiring consistent performance across demanding temperature ranges.
- Compact FCBGA package: 1517-BBGA (1517-FBGA supplier package) delivers high density in a surface-mount form factor for space-constrained boards.
- Controlled core voltage: Operates within a defined 870 mV–930 mV core supply window to support reliable power domain design and predictable device behavior.
Why Choose 5SGSED6K2F40I2G?
The 5SGSED6K2F40I2G positions itself as a high-capacity Stratix V GS FPGA for applications that demand extensive logic resources, significant on-chip memory, and a large number of I/O. Its industrial temperature rating and FCBGA packaging make it a practical choice for compact, ruggedized designs where integration and consistent operation matter.
Engineers building complex digital systems, multi-interface controllers, or dense signal-processing logic will find the combination of logic elements, embedded RAM, and I/O count beneficial for consolidating functionality and reducing board-level complexity.
Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the 5SGSED6K2F40I2G.

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