5SGSED6K2F40I2L

The 5SGSED6K2F40I2L is a Stratix V GS field-programmable gate array (FPGA) offering a high-density fabric and extensive on-chip resources for DSP-centric, transceiver-enabled designs. It leverages the Stratix V family architecture with an enhanced core, embedded hard IP blocks, and high-performance building blocks for bandwidth- and compute-intensive applications.

Targeted at industrial applications, this device combines approximately 583,000 logic elements, roughly 46.08 Mbits of embedded memory, and up to 696 I/Os in a 1517-BBGA FCBGA package. Its device-level features support complex signal processing, high-speed serial interfaces, and production-ready integration options.

Key Features

• Core Architecture (28 nm Stratix V)  Enhanced Stratix V core architecture with adaptive logic modules (ALMs) and a comprehensive fabric clocking and routing network.
• Logic Capacity  Approximately 583,000 logic elements (cells) to implement large-scale digital logic and control functions.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM organized in 20 Kbit (M20K) memory blocks for buffering and packet processing.
• Variable-Precision DSP Blocks  GS device DSP resources provide abundant variable-precision multipliers (family-level support for up to 3,926 18×18 or 1,963 27×27 multipliers) for high-performance signal processing.
• Integrated Transceivers  GS-class integrated transceivers with 14.1 Gbps capability for backplane and optical interface applications.
• I/O and Package  696 user I/Os in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package to support dense board-level connectivity.
• Power  Core voltage supply range 0.820 V to 0.880 V to match Stratix V power domains.
• Thermal & Environmental  Industrial-grade operating temperature range from −40 °C to 100 °C and RoHS compliance.
• Embedded Hard IP  Embedded HardCopy Block capability for hardening IP instances such as PCIe Gen3/Gen2/Gen1, enabling a low-risk path to HardCopy ASICs.

Typical Applications

• High-performance DSP systems  Use variable-precision DSP blocks and large on-chip memory for signal acceleration, filtering, and real-time processing.
• Network and packet processing  Implement packet engines and traffic management leveraging large logic capacity and plentiful I/O.
• Optical and backplane communications  Support 14.1 Gbps transceiver interfaces for 40G/100G-class modules and backplane links.
• Broadcast and military communications  Deploy in systems requiring high-throughput DSP and industrial temperature operation.
• Prototype-to-production ASIC flow  Prototype with Stratix V FPGA and pursue a low-risk path to HardCopy V ASICs using Embedded HardCopy Blocks.

Unique Advantages

• High logic density: Approximately 583,000 logic elements enable integration of complex SoC-style functions on a single device, reducing external components.
• Large embedded memory: Roughly 46.08 Mbits of on-chip RAM minimizes external buffering and accelerates data-path designs.
• DSP-centric architecture: Variable-precision DSP blocks provide scalable multiplier resources for demanding signal-processing workloads.
• High-speed serial capability: Integrated 14.1 Gbps transceivers support modern backplane and optical interfaces without separate PHYs.
• Industrial readiness: −40 °C to 100 °C operating range and RoHS compliance make the device suitable for industrial deployments.
• Production scalability: Embedded HardCopy Block and the Stratix V family roadmap enable a clear path from FPGA prototyping to hardened ASIC implementations.

Why Choose 5SGSED6K2F40I2L?

The 5SGSED6K2F40I2L combines Stratix V GS family architecture with high logic density, substantial embedded memory, and ample DSP and transceiver resources to address bandwidth- and compute-intensive designs. Its industrial temperature rating and dense FCBGA packaging support robust board-level integration for demanding environments.

This device is well suited for designers building advanced communications, signal-processing, and network infrastructure equipment who require integrated high-speed interfaces, large on-chip RAM, and a pathway to hardened implementations using Embedded HardCopy Blocks.

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